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Keywords: grain boundary diffusion
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021003.
Published Online: June 11, 2010
...X. Zhao; M. Saka; M. Yamashita; F. Togoh This paper is focused on evaluating the dominant factor for electromigration (EM) in sputtered high purity Al films. A closed-form equation of atomic flux divergence by treating grain boundary diffusion and hillock formation in a polycrystalline structure...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011002.
Published Online: February 11, 2009
... 2.9–3.7 73 712 2.8 ± 0.7 2.3–3.4 62 1156 3.1 ± 0.8 2.4–3.8 69 25 09 2007 17 04 2008 11 02 2009 annealing copper alloys grain boundary diffusion hardness hardness testing high-temperature effects silver alloys solders thermal...