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Journal Articles

Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations

Etienne L. Bonnaud
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041013.
https://doi.org/10.1115/1.4005451
Published Online: December 19, 2011
... to the observed complex material behavior, the nonlinear mixed hardening Armstrong and Frederick model combined with the Perzyna viscoplastic law was chosen to fit the experimental data. This model was subsequently implemented into a commercial finite element code and used to simulate drop tests. Actual drop test...
View Article titled, Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations
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Topics: Engineering simulation, Failure, Hardening, Lead-free solders, Simulation, Solder joints, Solders, Stress, Finite element analysis
Journal Articles

Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag. , 127, pp. 147–156)

M. Dube, T. Kundu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Discussions
J. Electron. Packag. December 2011, 133(4): 045502.
https://doi.org/10.1115/1.4000902
Published Online: November 17, 2011
...M. Dube; T. Kundu 20 03 2006 13 08 2009 17 11 2011 17 11 2011 compressibility elastoplasticity hardening solders viscoplasticity We respond to the technical content of the discussion as follows: 1 Discussant appears to have erroneously assumed...
View Article titled, Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag. , 127, pp. 147–156)
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Topics: Electrons, Solders, Hardening
Journal Articles

Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications

Xianjie Yang, C. L. Chow, K. J. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 148–158.
https://doi.org/10.1115/1.1649246
Published Online: April 30, 2004
... potential function with nonlinear mixed hardening is formulated. An algorithmic tangent stiffness tensor is derived and the model is implemented numerically into a commercial finite element (FE) code ABAQUS through its user-defined material subroutine. Several numerical simulations are conducted...
View Article titled, Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications
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Topics: Algorithms, Computer simulation, Constitutive equations, Damage, Hardening, Shear (Mechanics), Solders, Stress, Viscoplasticity, Finite element analysis