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Keywords: heat conduction
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021003.
Paper No: EP-12-1032
Published Online: March 28, 2013
... of substrate heat conduction on heat transfer from the embedded heat source to the coolant flow in the channel. From Fig. 4 of Ref. [ 33 ], we find the substrate conduction lowers the direct heat transfer from the heat source surface by about 10%, an insignificant number in this rule-of thumb estimate. From...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021002.
Paper No: EP-12-1031
Published Online: March 28, 2013
... can be learned from the calculations. multicore processor hot spot heat conduction Fourier-series solution checkered pattern cell arrangement Possible occurrence of hot spots on the integrated circuit chip has become a major source of concern for circuit designers. For current...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011008.
Published Online: March 10, 2011
... the VC. The sintered copper powder is isotropic. The vapor condenses and the liquid evaporates only at the interface between the vapor and liquid-wick regions. Thus, only heat conduction exists in the wick. Pores of the sintered copper powder are saturated with liquid. There is no gap...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011004.
Published Online: March 4, 2010
...Cheng-Hung Huang; Wei-Lun Chang A three-dimensional inverse heat conduction problem is solved in the present study by using the conjugate gradient method (CGM) and the general-purpose commercial code CFD − ACE + to estimate the strength of the unknown heat generation for an encapsulated chip...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031012.
Published Online: July 31, 2009
.... J. Heat Mass Transfer 0017-9310 , 43 ( 12 ), pp. 2101 – 2115 . 10.1016/S0017-9310(99)00283-5 2007 , COMSOL MULTIPHYSICS , version 3.3, Users’ Manuals. 29 07 2008 30 01 2009 31 07 2009 heat conduction heat exchangers numerical analysis heat exchangers...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021011.
Published Online: April 3, 2009
... and temperature distributions, maximum temperature heat sources, percentage contribution of plate (substrate) heat conduction on the heat removal from electronic components, temperature profile within finite conductive plate and local heat flux density at the plate—modules/PCM interface. The effect of these two...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
Published Online: March 27, 2009
... computational fluid dynamics finite volume methods forced convection heat conduction heat sinks metal foams stratified flow thermal conductivity 21 11 2007 07 01 2009 27 03 2009 2009 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041108.
Published Online: November 14, 2008
...Wataru Nakayama This paper reports the design study performed on a heat conduction panel having several heat sources at separate locations and a heat sink on one of the panel corners. The panel is given a thickness distribution so as to provide spatially varying heat conduction paths from the heat...
Journal Articles
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041106.
Published Online: November 14, 2008
... (rise from the ambient) decreases only by 2%. 2 As in “thermal vias” the effectiveness of through-vias is often expected to enhance heat conduction to the bottom of the PCB. However, the presence of large thermal resistance on the bottom surface compromises the thermal-via effect. Instead...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021011.
Published Online: May 15, 2008
... through experimentation and finite element analysis. 20 02 2007 03 10 2007 15 05 2008 atomic clocks bimetals chip scale packaging discs (structures) heat conduction switches temperature control thermal management (packaging) The goal of the DARPA chip scale atomic...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
Published Online: February 4, 2008
...% tolerance 10 × voltage divider. All sensor data was digitally recorded using an Agilent E8408A VXI mainframe with an E1413C 64 channel 16 bit A/D converter. coatings cooling electronics packaging evaporation heat conduction microprocessor chips pool boiling microporous...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 440–451.
Published Online: April 7, 2007
...James Geer; Anand Desai; Bahgat Sammakia This paper presents the results of an analytical study of steady state heat conduction in multiple rectangular domains. Any finite number of domains that are equally sized (in plane) may be considered in the current analysis. The thermal conductivity...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 324–327.
Published Online: August 31, 2006
... dimensional constraints. This paper shows a numerical approach, based on computational fluid dynamics (CFD) software, for the evaluation of the heat exchange performances of finned (straight fins) surfaces made of highly heat conductive material. The same geometric constraints assumed in a reference work were...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 109–114.
Published Online: December 5, 2005
... building blocks of spintronic devices. Experiments showed that the thermal resistance of nanoscale AlO x tunnel barriers increases linearly with thickness, which is consistent with the theory of energy transport in highly disordered materials. Heat conduction across a tunnel junction is impeded...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 226–235.
Published Online: August 18, 2005
... sintering heat conduction integrated circuit packaging thermal management (packaging) channel flow The integrated circuit (IC) industry is manufacturing denser and more powerful products, thus necessitating a better cooling technology to prevent the demand from heat dissipation devices...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 10–17.
Published Online: May 18, 2005
...Anand Desai; James Geer; Bahgat Sammakia An analytical model of steady state heat conduction in multiple cylindrical domains is presented and discussed. The domains are axisymmetric, contiguous, and coaxial. Three domains are considered in the current study. The thermal conductivities, thicknesses...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 325–332.
Published Online: October 6, 2004
... the reliability of electronic packaging structures. Therefore, it is important to provide designers a good estimate of free edge stresses. According to the heat conduction mechanism of integrated circuits, the temperature field distribution in the chip and substrate is derived and solved when the chip works...