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Keywords: heating elements
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 132–137.
Published Online: February 18, 2000
... November 1998 18 Feb 2000 organic compounds cooling thermal management (packaging) jets boiling foils heating elements forced convection dielectric liquids Immersion cooling of integrated circuit chips by dielectric coolant received considerable interest in the 1970s and 1980s...
