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Journal Articles

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
https://doi.org/10.1115/1.1534842
Published Online: March 14, 2003
... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 14 03 2003 surface mount technology printed circuit accessories printed circuit testing adhesives impact testing impact strength filled polymers conducting polymers shear...
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Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Shear (Mechanics), Shear strength, Solders, Silver, Resistors, Alloys
Journal Articles

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
https://doi.org/10.1115/1.1502666
Published Online: December 12, 2002
... printed circuit testing bending impact testing impact strength adhesives shear strength interconnections circuit reliability scanning electron microscopy failure (mechanical) Surface mount technology (SMT) continues to be significantly important to the electronics manufacturing industry...
View Article titled, Impact Resistance of SM Joints Formed With ICA
Open the PDF for Impact Resistance of SM Joints Formed With ICA in another window
Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Reliability, Shear (Mechanics), Shear strength, Solders, Silver, Resistors