... management challenges, and advanced 2D thermal management solutions are discussed. 04 06 2010 18 07 2011 09 12 2011 09 12 2011 integrated circuit packaging thermal management (packaging) three-dimensional integrated circuits 3D chip stacks thermal management through...

... 2011 cooling graphs integrated circuit packaging thermoelectricity Thermoelectric cooler design COP performance 3D TEC system analysis In recent years, cooling high heat flux systems such as computer microprocessors, logic memory, and power supplies have become a global...

... 03 2010 06 06 2011 14 09 2011 14 09 2011 finite element analysis integrated circuit packaging integrated circuit reliability Raman spectroscopy three-dimensional integrated circuits 3D packaging has spurred significant research into manufacturability and reliability...

... ( 5 6 7 ). ball bonding bonding parameters gold aluminide surface topographical aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography 29 07 2009 09 08 2010 09 12...

...) and operating at higher clock speed, higher Δ T can be realized. Based on this paper’s analysis, the optimized scenario resulted in a junction temperature of 56.6 ° C at the cost of a 14% performance loss. 28 10 2009 03 05 2010 25 06 2010 25 06 2010 delays integrated circuit...

... 16 01 2010 18 05 2010 23 06 2010 23 06 2010 cooling integrated circuit packaging integrated circuit reliability thermal management (packaging) In recent years, cooling of high heat flux systems such as computer microprocessors and memory have become global...

...John H. L. Pang Mechanical Design of Electronic Systems ,by Dally James W. Lall Pradeep Suhling Jeffrey C. . College House Enterprises, LLC , Knoxville, TN , 2008 19 03 2010 19 03 2010 integrated circuit design integrated circuit packaging integrated...

... circuit packaging joining processes anisotropic conductive adhesives (ACAs) copper anti-oxidant silane coupling agent electrical contact resistance reliability Electrically conductive adhesives (ECAs) have been extensively used for interconnection and joining materials...

... computational model for the simulation of practical epoxy molding compound encapsulation. 12 08 2007 28 09 2009 04 03 2010 04 03 2010 encapsulation finite difference methods integrated circuit packaging moulding plastic packaging semiconductor process modelling two-phase flow...

... accuracy. Special attention is made to analyze and eliminate the possible sources of measurement inaccuracy. A number of measurement examples prove the usability of the developed measuring instrument. 19 01 2009 20 05 2009 25 02 2010 25 02 2010 integrated circuit packaging...

... , Chapman & Hall , London . 2006 , http://www3.sympatico.ca/peter_budgell/ 18 04 2008 15 05 2009 12 11 2009 12 11 2009 CMOS image sensors integrated circuit packaging microfabrication microsensors Taguchi methods glass cover chip CMOS image sensor...

... joint. A key assumption in this derivation is that of self-similar crack growth. Strictly speaking, this is not the case for crack growth in solder joints, but is a reasonable assumption to make to obtain useful insight. integrated circuit interconnections integrated circuit packaging solders...

... reflow electronic package multiscale analysis diffusion integrated circuit packaging moisture numerical analysis vapour pressure 09 01 2008 22 03 2009 31 07 2009 2009 American Society of Mechanical Engineers ...

... rupture at reflow due to moisture is discussed in detail. The simulation results are consistent with the published experimental data. 18 09 2008 22 03 2009 31 07 2009 diffusion integrated circuit packaging moisture vapour pressure direct concentration approach moisture...

...-free solder strain rate effect tensile strength split Hopkinson tensile bar electronic products fractography integrated circuit packaging integrated circuit reliability solders stress-strain relations tensile strength tin compounds 19 06 2008 13 03 2009 16 06 2009...

... and background heat fluxes of up to 20 W / cm 2 , are reported. 25 08 2008 22 12 2008 03 04 2009 hot spots liquid cooling computational fluid dynamics heat sinks integrated circuit packaging micropumps thermal management (packaging) Recognizing these fundamental differences...

... melting temperature, high wettability, and ductility ( 1 ). These solder alloys are soon to be replaced with lead-free alternatives. ball grid arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections integrated circuit packaging...

... integrated circuit packaging integrated logic circuits microprocessor chips numerical analysis temperature distribution As the performance of microprocessor increases, the need to supply data and instructions to the core processor increases accordingly. In the past, this information, which...

... spreading resistance heat sinks integrated circuit packaging plates (structures) thermal conductivity thermal management (packaging) thermal resistance 10 03 2008 06 05 2008 11 02 2009 The one-dimensional, spreading, and total resistances with the aspect ratio...

... ball grid arrays ceramic packaging computational fluid dynamics deformation finite element analysis flip-chip devices integrated circuit interconnections integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical...