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Keywords: interconnect joints
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031010.
Paper No: EP-20-1102
Published Online: January 19, 2021
... μ m and height of 35 μ m were eventually achieved. To study the reliability performance of the interconnect joints made of Cu pillar microbumps with printed polymer cores, flip-chip bonding technology was successfully introduced and the interconnect joints between a designed bismaleimide triazine...