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Keywords: laminations
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041005.
Published Online: November 24, 2010
... Copper on the Mechanical Properties of the Flexible Copper-Clad Laminate ,” Microelectron. Eng. 0167-9317 , 84 , pp. 2653 – 2657 . 10.1016/j.mee.2007.05.063 Park , J. Y. , and Choi , C. K. , 2006 , “ Chemical Reaction of Sputtered Cu Film With Pi Modified by Low Energy Reactive...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021001.
Published Online: April 15, 2008
...Pavel Simacek; Suresh G. Advani; Kossi Zonvide; Leonard W. Barrett Manufacturing of printed circuit boards or chip-packaging substrates involves the use of resin-filled reinforcement materials, known as prepregs, to bond together laminates with patterned copper layers and serve as dielectric...