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Keywords: land grid array (LGA)
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021006.
Published Online: June 23, 2010
... requirements. Land grid array (LGA) package has been becoming popular in portable electronics in terms of low profile on the printed wiring boards and direct Pb-free assembly process compatibility. With the package profile shrinking and operating power increasing, solder joint quality and reliability has...
