... packaging heat transfer materials testing thermal conductivity thermal interface materials carbon nanotubes thermal resistance Thermal interface materials (TIMs) are used in electronics packaging to increase heat conduction across the interface between two relatively flat surfaces. A good...

..., but Wong ignored the effect of viscoelastic material. PCB drop impact dynamic analysis viscoelasticity materials testing printed circuit testing printed circuits substrates viscoelasticity 21 01 2006 15 03 2007 2007 American Society of Mechanical Engineers ...

... cyclic straining. solders electronics packaging materials testing deformation tin alloys silver alloys solder alloy time-dependent deformation nonproportional loading viscoplasticity constitutive model strain rate sensitivity dwell time The reliability of solder joints becomes...

... assembling surface mount technology printed circuit manufacture ball grid arrays chip scale packaging finite element analysis bending failure analysis solders materials testing reliability The increasing demand for smaller and faster products in the electronics industry has encouraged...

...) heat sinks adhesives contact resistance scanning electron microscopy radiography acoustic microscopy materials testing thermal interface materials interfacial resistance radiography SEM acoustic microscopy The joint between a thermal interface material (TIM) and a heat spreader...

... integrated circuit packaging materials testing surface roughness mechanical strength bending failure analysis silicon 30 08 2005 06 02 2006 Typical force P versus deflection δ curves for ( a ) point-load test I and II, and ( b ) four-point bending test...

... diameter. Figure 10 schematically illustrates the mode of failure of the gold ball bonds with and without aging and copper ball bonds when shear tested. 06 09 2004 23 11 2005 lead bonding integrated circuit packaging integrated circuit metallisation materials testing shear...

... element analysis calibration materials testing electronics packaging differential scanning calorimetry The compendium paper (Part 1: Models and Testing) presents details of the thermomechanical-digital image correction (TM-DIC) for testing of solders, test plan under variable temperature...

... alloys lead alloys fatigue viscoplasticity creep irreversible thermodynamics failure analysis finite element analysis materials testing failure (mechanical) 01 June 2001 01 October 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division...