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Keywords: microelectronic packaging
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041109.
Paper No: EP-23-1091
Published Online: August 9, 2024
... applications of ECAs in die attach, flip-chip bonding, and chip-on-flex (COF) packaging, highlighting their potential for various electronic devices. e-mail: ma2258@cornell.edu 27 12 2023 22 06 2024 09 08 2024 microelectronic packaging electrically conductive adhesives...
