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Keywords: microfabrication
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021005.
Published Online: June 23, 2010
.... 09 10 2009 26 03 2010 23 06 2010 23 06 2010 cooling electronics industry elemental semiconductors heat pipes microfabrication silicon thermal conductivity thermal resistance microheat pipes electronic cooling thermal conductivity thermal resistance performance...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041009.
Published Online: November 12, 2009
... package. Furthermore, the simulation results reveal that the heat dissipation efficiency of the proposed CIS package exceeds that of the traditional package by 245%. 18 04 2008 15 05 2009 12 11 2009 12 11 2009 CMOS image sensors integrated circuit packaging microfabrication...
Journal Articles