... is obtained with a 3 dB bandwidth of about 15 GHz. 11 10 2010 31 08 2011 09 12 2011 09 12 2011 computational electromagnetics electronics packaging microstrip lines modules optical interconnections optical modulation optoelectronic devices semiconductor lasers...

... 2006 25 06 2007 12 02 2008 numerical analysis optoelectronic devices scanning electron microscopes soldering solders surface tension fiber attachment soldering solder joint geometry self-alignment Alignment accuracy is a serious concern in coupling single-mode...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 optoelectronic devices glass stress analysis boundary-value problems packaging birefringence thermal expansion internal stresses thermal stresses In most...

... Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division June 22, 2001. Guest Editors: Y. Muzychka and R. Culham. 22 June 2001 10 06 2003 integrated circuit packaging semiconductor device packaging optoelectronic devices...

... dynamic testing life testing dynamic response integrated circuit packaging optoelectronic devices impact (mechanical) bending Drop tests are often substituted in qualification testing of microelectronic and photonic products by shock tests 1 . In shock tests, a specially designed...