.... 01 April 2003 01 November 2003 08 07 2004 solders flow through porous media plastic flow permeability numerical analysis flip-chip devices flow simulation Flip chip interconnects are being used in the electronics industry and have inherent advantages over other...

..., and 97.5Pb2.5Sn solders were determined from separated constitutive relations and experimental results. The achieved unified Anand model for solders were tested for constant strain rate testing, steady-state plastic flow and stress/strain responses under cyclic loading. It is concluded that the Anand model can...