1-4 of 4
Keywords: plates (structures)
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change

D. Sujan, Dereje E. Woldemichael, M. V. V. Murthy, K. N. Seetharamu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041014.
https://doi.org/10.1115/1.4005294
Published Online: December 21, 2011
... 2011 adhesive bonding copper electronics packaging elemental semiconductors gold plates (structures) shear strength silicon solders thermal stresses thin films tin bimaterial assembly interfacial shearing stress peeling stress shear compliance bond layer...
View Article titled, Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change
Open the PDF for Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change in another window
Topics: Manufacturing, Plates (structures), Shear (Mechanics), Shear stress, Solders, Stress, Temperature, Die cutting, Shearing (Deformation), Copper
Journal Articles

Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent Properties

Chih-Sung Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041006.
https://doi.org/10.1115/1.4005293
Published Online: December 9, 2011
... CTE or nonconsidering residual strain, especially for temperature above T g . 02 12 2010 30 09 2011 09 12 2011 09 12 2011 electronics packaging encapsulation plates (structures) polymers stress-strain relations viscoelasticity thermomechanical analysis...
View Article titled, Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent Properties
Open the PDF for Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent Properties in another window
Topics: Stress, Temperature, Warping, Thermomechanics
Journal Articles

Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance

Yen-Shu Chen, Kuo-Hsiang Chien, Yung-Shin Tseng, Yea-Kuang Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011004.
https://doi.org/10.1115/1.3068299
Published Online: February 11, 2009
... analytical solution spreading resistance heat sinks integrated circuit packaging plates (structures) thermal conductivity thermal management (packaging) thermal resistance 10 03 2008 06 05 2008 11 02 2009 2009 American Society of Mechanical Engineers ...
View Article titled, Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance
Open the PDF for Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance in another window
Topics: Approximation, Heat, Heat sinks, Plates (structures), Thermal conductivity, Thermal resistance, Temperature distribution, Heat conduction, Design
Journal Articles

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Siddharth Bhopte, Musa S. Alshuqairi, Dereje Agonafer, Fellow ASME, Gamal Refai-Ahmed, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 519–523.
https://doi.org/10.1115/1.1827267
Published Online: January 24, 2005
... by: B. Sammakia. 21 May 2004 19 July 2004 24 01 2005 heat sinks electronics packaging plates (structures) cooling convection jets nozzles flow simulation finite volume methods telecommunication Lee , D. Y. , and Vafai , K. , 1999 , “ Comparative...
View Article titled, Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application
Open the PDF for Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application in another window
Topics: Heat sinks, Mixed convection, Reynolds number, Nozzles, Cooling, Computer simulation, Heat, Flow (Dynamics), Rayleigh number