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Keywords: porous materials
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 259–266.
Published Online: September 23, 2005
... configuration for even larger enhancement in heat transfer. 25 05 2005 23 09 2005 heat sinks cooling electronics packaging convection porous materials metal foams aluminium Horton , C. W. , and Rogers , F. T. , 1945 , “ Convection Currents in Porous Media ,” J. Appl...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 226–235.
Published Online: August 18, 2005
... by using Eq. 23 and the data in Fig. 13 . Results from this study illustrate the potential of the porous heat sink with periodically metallic baffles for heat transfer enhancement. However, they are restricted to the same porous material, baffle material, fluid stream, etc., suggesting the need...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 127–134.
Published Online: June 1, 2004
... in this study is an open-cell porous material that consists of a network of interconnected graphite ligaments whose thermal conductivities are up to five times higher than copper. While the bulk graphite foam has a thermal conductivity similar to aluminum, it has one-fifth the density, making it an excellent...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 223–234.
Published Online: May 8, 2004
... a theoretical model to predict the permeability ( K ) and inertial coefficient ( C F ) of foamlike porous material with very high porosity. Antohe et al. ( 2 ) and Lage et al. ( 3 ) experimentally decided the permeability ( K ) and inertial coefficient ( C F...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 155–163.
Published Online: July 26, 2002
...) forced convection thermal resistance foams porous materials flow through porous media boundary layers cooling aluminium The large-scale integration of electronic circuits has resulted in a continuous increase in chip power dissipation requirements. According to the SIA roadmap 1...