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Keywords: pressure sensors
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041001.
Published Online: October 16, 2009
... to measure the leak rate because the measured leak rate was nonlinear with respect to the actual leak size. According to the fact that the damping coefficient changes with the pressure, a tuning fork crystal chip as a pressure sensor was used to monitor the pressure changes in the package cavity. The leak...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031013.
Published Online: July 31, 2009
...Lung-Tai Chen; Wood-Hi Cheng This study presents a novel technique for an overmolded package of piezoresistive pressure sensors using an ultrathick photoresist sacrificial layer. A 150 μ m photoresist block is placed just on the silicon membrane of the pressure sensor and removed after the molding...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 470–474.
Published Online: December 15, 2003
...J. Albert Chiou, Mem. ASME; Steven Chen; Jinbao Jiao The pressure sensor is one of the major applications of microelectromechanical systems (MEMS). An absolute pressure sensor utilizes anodic bonding to create a vacuum cavity between the silicon diaphragm and glass substrate. The manifold absolute...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 466–469.
Published Online: December 15, 2003
... June 2003. Associate Editor: Y. C. Lee. 01 May 2001 01 June 2003 15 12 2003 pressure sensors piezoresistive devices finite element analysis Various kinds of pressure sensors have been produced 1 . One of them is the Differential Pressure Feedback (DPFE) Sensor...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 79–82.
Published Online: May 26, 2000
... from the conductive carbon prepregs. Procedural techniques are developed and discussed for isolating the pressure sensor’s flow-opening, from the exposure to the prepreg epoxy flow and exposure to the fibrous particles, during the autoclave curing of the composite laminate. The effects of the autoclave...