.... Comparisons between these predicted optimal designs and those evaluated by the theoretical calculations and numerical simulations are made with satisfactory agreements. 27 09 2004 21 12 2004 heat sinks thermal management (packaging) integrated circuit packaging regression analysis...

... regression analysis finite element analysis High throughput is one of the main factors that are lowering the cost of electronic products. To achieve high throughput, various WLP technologies have been invented by many institutions and companies since 1994 1 . WLP is defined as the complete...