...Shin-ichi Satake; Gaku Sorimachi; Takahiro Kanai; Jun Taniguchi; Noriyuki Unno A high time-resolution measurement of flow field in a glass plate with glass cover with two holes was done by a micro-DHPTV system. The two holes mentioned here were also inside the photo-curable resin. Particle...

... of horizontal copper and resin; outside the BGA-covered area the board is a copper/resin laminate and its surfaces are exposed to cooling air. Calculations are performed on a sample board having the dimensions 11 × 11 cm 2 ( footprint ) × 1.26 mm (thickness). The model of the board has two internal layers...

... parameters include initial bonding force F , number of particles N , the adhesion strength G A , and modulus of elasticity E of the cured resin. It is well known that as the bonding force increases, the contact resistance decreases. However, when the bonding force reaches a certain maximum value, the contact...

...Pavel Simacek; Suresh G. Advani; Kossi Zonvide; Leonard W. Barrett Manufacturing of printed circuit boards or chip-packaging substrates involves the use of resin-filled reinforcement materials, known as prepregs, to bond together laminates with patterned copper layers and serve as dielectric...

...-chip devices resins integrated circuit packaging integrated circuit reliability integrated circuit interconnections nanotechnology soldering thermal expansion While flip chip has emerged as an attractive chip packaging methodology because of low cost, high interconnect density, low...

... many reliability issues arise, including warpage of the package, premature interfacial failure, and degraded interconnections. Bimaterial strip bending experiment has been employed successfully to monitor the evolution of the residual stresses in underfrill resins for flip chip applications...

...Jong-Min Kim; Kiyokazu Yasuda; Kozo Fujimoto We have demonstrated the self-alignment processes using surface tension of the resin material for the self-assembly systems. It has been known that the surface tension of the resin material is too low to achieve the self-alignment capability. This paper...

..., solvent-free type, prepared in a special way on the base of the common, accessible resins. They have very convenient handling properties; e.g., no drying on open screen during printing process. Viscosity depends on the resin and may be intentionally changed. Shelf life for all these formulations is about...