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Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2007, 129(1): 109–110.
Published Online: March 1, 2007
... serves as an excellent reference for any engineer working in the electronics industry. This reviewer highly recommends this book. Lead-Free Implementation and Production–A Manufacturing Guide ,by Hwang Jennie S. . McGraw-Hill , New York, NY, 2005, 473 pp., $99.95 , ISBN: 0-07-144374-6...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 2005, 127(4): 539.
Published Online: December 1, 2005
...ANTHONY J. RAFANELLI Practical Guide to the Packaging of Electronics ,by Jamnia Ali . Marcel Dekker, Inc. , New York, NY, 2003, 202 pp., $135.00 , ISBN: 0-8247-0865-2 reviews electronics packaging This reviewer says “kudos” to Ali Jamnia for going “back to the building...
Journal Articles
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2005, 127(4): 530–536.
Published Online: December 22, 2004
... dielectric thin films integrated circuit packaging reviews In microelectronic manufacturing processes such as wafer processing, packaging, and assembling, polymers are more and more used because of their excellent insulation properties, low dielectric constant, and good chemical resistance. Due...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2002, 124(1): 67–68.
Published Online: March 1, 2002
...D. Satas,, Editor,; Arthur A. Tracton,, Editor, and; Anthony J. Rafanelli, Reviewer coating techniques reviews testing Coatings Technology Handbook, Second Edition , edited by D. Satas and Arthur A. Tracton, Marcel-Dekker, Inc., New York, 2001, 902 pp., ISBN: 0-8247-0439-8, $225.00...
Topics: Coatings, Testing
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 105–111.
Published Online: October 20, 2000
... be developed with reasonable effort, to withstand the Mars thermal environment for a mission duration of approximately one earth year. Our conclusion, from a review of literature and personal contacts, is that die attachment can be made sufficiently reliable to satisfy the requirements of future Mars rovers...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 2000, 122(2): 178–179.
Published Online: June 1, 2000
...Michael Pecht,, Editor; Anthony J. Rafanelli,, Reviewer [S1043-7398(00)01502-4] In summary, Handbook of Electronic Package Design provides a very comprehensive collection of all vital elements in electronic packaging development. Important concepts such as reliability, manufacturability...