... 14 09 2010 23 08 2011 23 12 2011 23 12 2011 elemental semiconductors finite element analysis microprocessor chips semiconductor device models semiconductor device packaging silicon temperature distribution thermal analysis thermal management (packaging) transistors...

... computational fluid dynamics cooling light emitting diodes optimisation printed circuits semiconductor device packaging thermal management (packaging) light-emitting diode printed circuit board LED array thermal modeling Oon , S. L. , 2009 , “ The Latest LED Technology...

... thermal cooling gallium arsenide gallium compounds genetic algorithms heterojunction bipolar transistors III-V semiconductors indium compounds semiconductor device packaging thermal management (packaging) thermal resistance thermal stability 29 05 2010 03 12 2010 09 03...

... circuit reliability integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability This book entitled “ Mechanical Design of Electronic Systems ” is written from a mechanical design perspective to introduce...

... semiconductor device packaging silicon stress effects residual stress piezoresistive gauge nMOSFET DC characteristics electron-mobility A semiconductor device is sometimes subjected to high residual stress during the packaging (resin-molding) process. This is due to the large mismatch...

... ) . The base will also not have a benefit when the size of the chip approaches that of the copper block ( A ∗ = 1 ) . cooling finite element analysis heat pipes heat sinks semiconductor device packaging heat transfer heat flux centrifugal fan circular stacked heat sink finite element analysis...

... biological organs cancer cooling dosimetry flow simulation laser applications in medicine photodynamic therapy semiconductor device packaging semiconductor lasers thermal management (packaging) tumours Esophageal cancer is a significant cause of cancer-related deaths in the United States...

... provides specific information about the thermal path being influenced by the chimney. 25 04 2008 01 07 2008 12 02 2009 cooling natural convection semiconductor device packaging thermal conductivity thermal management (packaging) thermal resistance transistors The use...

... 10 2007 14 05 2008 finite element analysis heat transfer moisture semiconductor device packaging stress analysis Semiconductor packages are usually subjected to both temperature and humidity during their service life. The hygroscopic swelling mismatch induced deformations...

... nanoelectronics transistors semiconductor device packaging ballistic transport thermal analysis The technological revolution that started with the introduction of the transistor just over half a century ago is without parallel in the way it has shaped our economy and our daily lives. The current trend...

... conditions must be limited for reliability goals to be achieved and this implies that the operating temperatures may have to be kept even lower than the maximum rating of the device. semiconductor device packaging finite element method soldering cooling semiconductor device packaging power...

...) at a power dissipation level of 12.5 W , which is equivalent to a steady-state current conduction of 25 A . 13 06 2005 15 08 2005 power MOSFET modules semiconductor device packaging cryogenic electronics cooling Temperature distributions for ( a ) discrete...

... that is positioned at the outermost V-groove in the array, cannot be ignored. Manuscript received January 7, 2004; revision received August 13, 2004. Review conducted by: Y. C. Chan. 07 January 2004 13 August 2004 21 03 2005 silicon elemental semiconductors semiconductor device...

...% over the entire temperature and power ranges. Manuscript received April 23, 2004; revision received June 22, 2004. Review conducted by B. Sammakia. 23 April 2004 22 June 2004 24 01 2005 integrated circuit packaging semiconductor device packaging heat exchangers heat...

... management (packaging) semiconductor device packaging product development quality management reliability safety electronics industry Thermal Characterization Compact Modeling Dynamic Measurements Test Dies Reliability Many roadmaps recognize thermal management as one of the major...

... storage temperature distribution solidification melting semiconductor device packaging power semiconductor devices 01 June 2003 01 February 2004 06 10 2004 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING...

..., the two failure mechanisms can be interrelated, especially when interface cracking is in close proximity to the solder connections. solders cracks semiconductor device packaging viscoplasticity plastic deformation fracture internal stresses 01 March 2003 01 November 2003 30...

... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, December 4, 2001. Associate Editor: B. Courtois. 04 December 2001 17 09 2003 ceramic insulation ceramic packaging semiconductor lasers semiconductor device...

... Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division June 22, 2001. Guest Editors: Y. Muzychka and R. Culham. 22 June 2001 10 06 2003 integrated circuit packaging semiconductor device packaging optoelectronic devices...

... September 2000 05 October 2001 12 12 2002 semiconductor device packaging heat transfer natural convection temperature measurement simulation transients Advances in the packaging of portable electronic devices (cellular phones, laptop computers, etc.) reduce their size per...