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Keywords: semiconductor device reliability
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Journal Articles

Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations

Etienne L. Bonnaud
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041013.
https://doi.org/10.1115/1.4005451
Published Online: December 19, 2011
... failure. electronics packaging finite element analysis hardening semiconductor device reliability semiconductor device testing solders viscoplasticity 29 06 2010 19 10 2011 19 12 2011 19 12 2011 2011 American Society of Mechanical Engineers ...
View Article titled, Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations
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Topics: Engineering simulation, Failure, Hardening, Lead-free solders, Simulation, Solder joints, Solders, Stress, Finite element analysis
Journal Articles

Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes

Eduardo Nogueira, Manuel Vázquez, Carlos Algora
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2011, 133(3): 034501.
https://doi.org/10.1115/1.4004659
Published Online: September 14, 2011
... an activation energy of 0.87 eV and a Peck parameter of 2.29. MTTF value of 1.582 × 10 6 h at low bias current, 10 mA, has been evaluated. 20 07 2010 19 05 2011 14 09 2011 14 09 2011 failure analysis life testing light emitting diodes semiconductor device reliability...
View Article titled, Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes
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Topics: Epoxy adhesives, Epoxy resins, Failure, Light-emitting diodes, Temperature, Circuits
Journal Articles

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

Xin Li, Xu Chen, Guo-Quan Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031011.
https://doi.org/10.1115/1.4002299
Published Online: September 30, 2010
... and testing process. This experiment evaluates the package reliability due to heat and moisture. 16 11 2009 06 07 2010 30 09 2010 30 09 2010 bonding processes light emitting diodes semiconductor device reliability silver thermal management (packaging) high-power LED...
View Article titled, Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials
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Topics: Bonding, Epoxy adhesives, Epoxy resins, Light-emitting diodes, Packaging, Reliability, Silver, Temperature, Tin, Heat
Journal Articles

Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

Takashi Anzawa, Qiang Yu, Masanori Yamagiwa, Tadahiro Shibutani, Masaki Shiratori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031012.
https://doi.org/10.1115/1.4002451
Published Online: September 30, 2010
... . 10.1016/j.microrel.2007.08.008 29 11 2009 08 08 2010 30 09 2010 30 09 2010 cracks fracture mechanics insulated gate bipolar transistors lead bonding power bipolar transistors semiconductor device reliability temperature distribution thermal analysis thermal stress...
View Article titled, Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis
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Topics: Bonding, Crack propagation, Fatigue life, Fracture (Materials), Reliability, Solder joints, Temperature, Temperature distribution, Wire, Wire bonding
Journal Articles

Mechanical Design of Electronic Systems

John H. L. Pang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
https://doi.org/10.1115/1.4000755
Published Online: March 19, 2010
... integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability 19 03 2010 19 03 2010 Mechanical Design of Electronic Systems ,by Dally James W. Lall Pradeep Suhling Jeffrey C...
View Article titled, Mechanical Design of Electronic Systems
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Topics: Circuits, Design, Design engineering, Electronic systems, Reliability, Testing, Integrated circuits, Circuit design, Integrated circuit packaging, Life testing
Journal Articles

Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability

John G. Bai, Jesus N. Calata, Guo-Quan Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 208–214.
https://doi.org/10.1115/1.2229218
Published Online: August 26, 2005
... semiconductor devices cooling solders semiconductor device reliability finite element analysis thermal expansion thermal management (packaging) 03 01 2005 26 08 2005 2006 American Society of Mechanical Engineers ...
View Article titled, Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability
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Topics: Cooling, Finite element analysis, Reliability, Solders, Temperature, Stress, Thermomechanics, Thermal expansion
Journal Articles

Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading

Cemal Basaran, Assoc. Prof., and Director,, Rumpa Chandaroy, Staff Consultant,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. March 2002, 124(1): 60–66.
https://doi.org/10.1115/1.1400752
Published Online: March 15, 2001
... 15, 2001. Associate Editor: Yi-Hain Pao. 15 March 2001 lead alloys tin alloys soldering thermal expansion thermal stresses vibrations fatigue life testing fatigue testing semiconductor device reliability integrated circuit reliability packaging finite element analysis...
View Article titled, Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading
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Topics: Constitutive equations, Damage, Fatigue life, Solder joints, Stress, Thermomechanics, Vibration, Finite element analysis, Reliability, Thermal expansion