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Keywords: semiconductor device testing
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041013.
Published Online: December 19, 2011
... failure. electronics packaging finite element analysis hardening semiconductor device reliability semiconductor device testing solders viscoplasticity 29 06 2010 19 10 2011 19 12 2011 19 12 2011 2011 American Society of Mechanical Engineers ...
