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Keywords: shear load to failure
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041116.
Paper No: EP-24-1029
Published Online: August 17, 2024
...-sectional area (CSA) of printed lines is computed by integrating the bell-shaped CSA obtained from the WLI test. Electrical and mechanical properties are quantified in terms of resistivity and shear load to failure. Optimized parameters from the printing and sintering process are employed to print traces...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021117.
Paper No: EP-21-1066
Published Online: March 11, 2022
... exposure to temperature for the purpose of sintering. The downstream-printed conductive lines would undergo different sintering conditions and would then be tested for parameters such as interconnect resistance and shear load to failure. This paper explores the printing of multilayer up to eight conductive...