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Keywords: solidification
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
Published Online: October 6, 2004
... thermal management (packaging) thermal conductivity thermal analysis thermal energy storage temperature distribution solidification melting semiconductor device packaging power semiconductor devices Phase change thermal energy storage is one of three available ways to store heat, the other...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 335–346.
Published Online: September 17, 2003
... properties are considered in the model. Specifically, the loss of solvents in the vehicle system, melting, solidification and further single phase cooling of the solder paste are contemplated in the model. Experiments were conducted with the objective of validating the predictions of the solder paste...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 153–156.
Published Online: March 14, 2003
... the same “heating factor”—the integral of the measured temperature above the liquidus (183°C) with respect to dwell time in the reflow profile, but to have different conveyor speeds. Using the theory of heat transmission, it is shown that the solder joint cooling rate during solidification increases...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 290–294.
Published Online: July 14, 1999
... that increasing conveyor speed increases the cooling rate during solder solidification. SEM micrographs reveal that cracks initiated at the acute point near the PCB solder pad, then propagate along the interface of the bulk solder/IMC layer. The test results are ascribed to roughing interface of the bulk solder...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 168–171.
Published Online: March 15, 1999
...J. Z. Shi; X. M. Xie; F. Stubhan; J. Freytag A novel two-step process based on isothermal solidification is developed for die attachment of ceramic package. With a simple design of the multilayer system, silicon chip could be bonded onto the allumina substrate in between 200°C and 300°C. The total...