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Keywords: temperature distribution
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
Published Online: December 23, 2011
... and simulation. Detailed temperature distribution caused by a single heat source is obtained using the finite element sub-modeling technique, while the temperature rise distribution caused by multiple heat sources is obtained by superimposing the finite element analysis result. Using the proposed thermal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031012.
Published Online: September 30, 2010
...Takashi Anzawa; Qiang Yu; Masanori Yamagiwa; Tadahiro Shibutani; Masaki Shiratori This paper presents a simulation method to evaluate the thermal fatigue life of a power module. A coupled electrical-thermal analysis was performed to obtain the nonuniform temperature distribution of electric current...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041010.
Published Online: November 12, 2009
...Sheng Liu; Wenming Liu; Changyong Lin; Mingxiang Chen A novel ceramic packaging technology by using selective induction heating is presented. Some aspects of this packaging process, including local temperature distribution, hermeticity, tensile strength, and fracture analysis, were tested...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2009, 131(4): 044501.
Published Online: October 21, 2009
..., and the novelty of this work is that both 2D and 3D temperature-distribution analyses are performed. The 2D results indicate that the original thermal-via configuration can be reduced by 29%. Furthermore, the results show that the maximum temperature within the collector calculated from 3D analysis is lower than...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011009.
Published Online: February 13, 2009
... was to determine if welding of the output-can onto the initiator header could produce stresses in the glass great enough to cause cracking. A finite element analysis solution was chosen to model the transient heat transfer and temperature distribution in the initiator assembly during the welding process...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 19–27.
Published Online: September 20, 2006
...Zone-Ching Lin; Chang-Cheng Chen A molding model is established in this study based on a real integrated circuit for simulating the molding process. This paper presents both the temperature distribution and the thermal stress field of the molding model while the simulation proceeded along...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 56–62.
Published Online: May 19, 2006
... of the solder composition increases, the fatigue life increases under 5 kA ∕ cm 2 at 150 ° C but decreases under 20 kA ∕ cm 2 at 30 ° C . Observed electromigration morphologies along with computed current density and temperature distributions on solder interconnects from the electrothermal coupling analysis...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 28–34.
Published Online: May 1, 2006
... and conservative nature of life prediction. It was well accepted and served its role effectively for ceramic packages. In reality, an assembly is subjected to a power cycling, i.e., nonuniform temperature distribution with a chip as the only heat source and other components as heat dissipaters. This non-uniform...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 106–112.
Published Online: June 3, 2005
... crystals and shroud-transient techniques are used to measure spatially resolved surface temperature distributions, which are used to deduce local Nusselt numbers. Dimensionless pedestal heights H / D are 0, 0.5, 1.0, and 1.5, the jet Reynolds number Re is 23,000, and the surface distance to nozzle diameter...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 384–389.
Published Online: October 6, 2004
... 2004. Associate Editor: W. King. 01 August 2003 01 April 2004 06 10 2004 microprocessor chips thermal resistance integrated circuit packaging flip-chip devices thermal stresses temperature distribution cooling flow simulation In the past decade, simulation...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
Published Online: October 6, 2004
... thermal management (packaging) thermal conductivity thermal analysis thermal energy storage temperature distribution solidification melting semiconductor device packaging power semiconductor devices Phase change thermal energy storage is one of three available ways to store heat, the other...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 247–255.
Published Online: July 8, 2004
..., the heat sink is heated uniformly at the bottom. The resulting pressure drop across the heat sink and the temperature distribution at its bottom are then measured and are compared with those obtained through the porous medium approach. Upon comparison, the porous medium approach is shown to accurately...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 124–134.
Published Online: April 30, 2004
... in two parts: first, surface temperature distribution and velocity field data are presented for the case of the fan drawing air from the system. The flow was found to be parallel and uniform. There were symmetrical temperature gradients across the board that were readily explained in terms of board...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 624–629.
Published Online: December 15, 2003
... stress analysis thermal stress cracking temperature distribution plastic packaging Flip chip (FC) technology can achieve the highest ratio of active silicon surface area since it does not employ the peripheral wire bonding. In this way, it can be used to achieve a very large number of fine...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 335–346.
Published Online: September 17, 2003
... from the temperature distributions of heating panels, temperature distribution of convective gas and the provided flow velocity distributions as inputs to the numerical model. Figures 11 ( a ) and ( b ) show experimental and predicted profiles for the solder paste at a conveyor velocity of 0.8467...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 456–460.
Published Online: September 17, 2003
...A. G. Agwu Nnanna; A. Haji-Sheikh ,, ASME Fellow; D. Agonafer,, ASME Fellow A constant heat transfer coefficient is often assumed in the computation of the temperature distribution along an extended surface. This assumption permits the use of a well-established closed form analytical solution thus...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 169–177.
Published Online: June 10, 2003
... 1 , … , r 11 are given in Table 1 . It was found 5 that when ε<0.3, the heat flux distribution produces a contact area temperature distribution which for most practical applications can be considered to be isothermal. It was reported 5 that when ε=0.4 and ε=0.5...