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Keywords: thermal reliability
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041003.
Paper No: EP-18-1070
Published Online: May 24, 2019
... error was less than 2.5%. By optimizing process parameters, the shear strength between dam and DPC substrate reached up to 9.5 MPa. Moreover, thermal cycle and heat resistance tests confirmed that 3DPC exhibits excellent thermal reliability. All experimental results demonstrated that 3DPC ceramic...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021006.
Published Online: June 23, 2010
... of laser ultrasound signals. 01 06 2009 22 04 2010 23 06 2010 23 06 2010 cracks electronics packaging reliability solders ultrasonic materials testing X-ray applications land grid array (LGA) solder joint laser ultrasound thermal reliability Based...