... integrated circuit testing microcracks nondestructive testing printed circuit manufacture solders synchrotron radiation thermal stress cracking X-ray imaging thermal fatigue life prediction crack propagation phase growth solder joints flip chip, nondestructive inspection x-ray...

... ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high reliability microelectronics applications...

... transistors lead bonding power bipolar transistors semiconductor device reliability temperature distribution thermal analysis thermal stress cracking In this paper, a simulation method to assess the thermal fatigue reliability of solder joints in power electronics is developed by using...

... 2008 assembling flip-chip devices integrated circuit interconnections integrated circuit layout integrated circuit reliability thermal stress cracking viscoelasticity In Part 1 of this paper, various failure mechanisms associated with the short-time wave propagation in the flip...

... 2007 08 05 2008 aluminium compounds gas lasers laser beam cutting laser beam machining thermal stress cracking aluminum nitride cutting laser thermal stress packaging material Aluminum nitride (AlN) is an effective electronic packaging material due to its excellent...

... and impervious to the surrounding environment. cooling finite element analysis glass seals (stoppers) thermal management (packaging) thermal stress cracking wires 24 05 2006 29 11 2006 2007 American Society of Mechanical Engineers ...

.... Review conducted by: C. Basaran. 24 October 2004 17 May 2004 03 06 2005 ceramic packaging strain ageing chip-on-board packaging integrated circuit packaging integrated circuit reliability integrated circuit interconnections printed circuits solders thermal stress...

...) integrated circuit reliability integrated circuit packaging creep testing thermal stress cracking solders Young's modulus thermal expansion glass transition thermal analysis finite element analysis The need of ultra-dense and high I/O for integrated circuit designs has driven the development...

... received May 2003; final revision, Jan. 2004. Associate Editor: S. McKeown. 01 May 2003 01 Jan 2004 06 10 2004 thermoelasticity heat conduction thermal stress cracking integrated circuit reliability thermal stresses Fourier series integrated circuit packaging...

... integrated circuit packaging thermal management (packaging) soldering thermal stress cracking fracture delamination When a plastic encapsulant absorbs moisture, it expands and causes hygrostresses to be developed in plastic-encapsulated IC packages. This is because of moisture concentration...

... devices polymers dielectric materials fracture delamination thermal stress cracking aluminium silicon To fabricate interconnect bump with BCB passivation, the adhesion promoter (AP3000 [Vinyltriacetoxysilane]) and BCB (Cyclotene™ 4024) were spin-coated on p-type (100) Si substrates...

... delamination fracture mechanics viscoelasticity elasticity thermal analysis thermal stress cracking When a plastic IC package is in a reflow soldering process, the thermal stress in the molded package occurs due to the mismatch of thermal expansion coefficients between the parts of package at high...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received November 2002. Associate Editor: L. Ernst. 01 November 2002 15 12 2003 soldering flip-chip devices creep thermal stress cracking fatigue The removal of lead from electronic products necessitates the replacement...

... devices thermal stress cracking finite element analysis failure analysis As new packaging technologies emerge, thermo-mechanical reliability aspects have to be optimized or compared to the traditional approaches. Accordingly, the ability of the computational design of reliable solder joints...

... stress analysis thermal stress cracking temperature distribution plastic packaging Flip chip (FC) technology can achieve the highest ratio of active silicon surface area since it does not employ the peripheral wire bonding. In this way, it can be used to achieve a very large number of fine...

... 2002 17 09 2003 ball grid arrays thermal stress cracking soldering reliability surface mount technology finite element analysis Thermal fatigue has been one of the most serious problems for solder joint reliability in electronic packaging. Many researchers have studied...

... Congress, New York, NY, November 11–16, 2001. Manuscript received at ASME Headquarters, Sept. 2002. Associate Editor: J. Lau. 11 November 2001 01 Sep 2002 17 09 2003 plastic packaging ball grid arrays thermal stress cracking soldering finite element analysis modelling...

... thermal stresses thermal expansion integrated circuit modelling finite element analysis plastic packaging optical fibre theory thermal stress cracking Thermal stresses and deformations are the major contributor to malfunctions of, and failures in, microelectronics and photonics systems...

... soldering finite element analysis ball grid arrays integrated circuit packaging thermal stress cracking modelling viscoplasticity With the increasing use of surface mount bonding technology in microelectronics industry, the reliability concerns for solder joints are increasing exponentially...

... dissimilar materials as shown in Fig. 1 , which are stress singular points. moisture moulding plastic packaging integrated circuit packaging delamination thermal stress cracking bending finite element analysis reflow soldering failure analysis 21 April 2001 04 January 2002...