1-20 of 32
Keywords: thermal stresses
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041014.
Published Online: December 21, 2011
... , Thermal Management Handbook ( McGraw-Hill , New York ), p. 1.1 . 2 Wang , W. C. , and Hsu , J. S. , 2004 , “ Re-Examination on Thermal Stresses of Bonded Structures ,” J. Strain Anal. Eng. Des. , 39 ( 3 ), pp. 261 – 270 . 10.1243/030932404323042687 3 Vujosevic , M...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041003.
Published Online: December 8, 2011
... management task for the artillery application challenging. The ability to accurately analyze these designs requires the use of fully coupled thermal-stress transient-analysis with accurate material properties over the full temperature range. To highlight the thermal-stress transient effects, the potted...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041008.
Published Online: October 29, 2009
.... The large temperature difference between the substrate and chip produced a high thermal stress, and the large bonding force generated a high mechanical stress. The thermal and mechanical stresses were the reasons for warpage in a COG module. For the high reliability, the design and bonding process...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011009.
Published Online: February 13, 2009
.... These cracks could be a path for moist gas to diffuse into the initiator, potentially leading to bridge-wire degradation and late-fire or no-fire initiator failure. Previous research has shown that cracking may be caused by thermal stresses induced by the GTMS formation process. The goal of this research...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011003.
Published Online: February 11, 2009
...M. A. Neidigk; Y.-L. Shen The generation of thermal stresses is a major cause for mechanical failure in encapsulated electronic components. In this study numerical modeling is employed to analyze thermal stresses in a high-voltage transformer encapsulated with filled epoxy. The transformer assembly...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021008.
Published Online: May 9, 2008
... scale cracks or interfacial adhesion flaws initiated at the short-time scale would be further propagated by the coefficient of thermal expansion induced thermal stresses at the long-time scale and result in eventual electrical disruptions. 21 02 2007 26 09 2007 09 05 2008 failure...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 314–323.
Published Online: November 24, 2004
...H. R. Ghorbani; J. K. Spelt A two-dimensional model has been developed for the interfacial thermal stresses in short and long trilayer assemblies under both plane stress and plane strain conditions. Interfacial stresses are approximated using a combination of exact elasticity solutions...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 325–332.
Published Online: October 6, 2004
...Linzhi Wu The presence of dissimilar material systems and thermal gradients introduces thermal stresses in multi-layered electronic assemblies and packages during fabrication and operation. The thermal stresses of the chip-substrate structure near free edges play an important role in determining...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 351–358.
Published Online: October 6, 2004
...; final revision, Jan. 2004. Associate Editor: W. King. 01 July 2003 01 Jan 2004 06 10 2004 flip-chip devices thermomechanical treatment bending internal stresses thermal stresses integrated circuit packaging Flip chip packaging is considered to be an advanced form...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 384–389.
Published Online: October 6, 2004
... of heater was also investigated to optimize the heater efficiency under different thermal contact between the IC package and the thermal head. Stress simulation was performed on the heater plate and the IC package subject to the temperature profile. The thermal stress and deformation were found...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 235–236.
Published Online: August 24, 2004
... of the heating experienced by an electronic package during use, thermal stresses are often encountered, particularly when there is a mismatch in the coefficient of thermal expansion (CTE) of adjoining materials in the package. The thermal stresses may cause warpage, interface degradation, and even debonding...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 115–119.
Published Online: April 30, 2004
...M. Y. Tsai; C. H. Hsu; C. N. Han The well-known, closed-form solution to thermal stresses of a die-substrate assembly is initially provided by Suhir in the mid-1980’s after Timoshenko [1] and Chen and Nelson [2] . It has been revised several times in its die attach (adhesive) peel solution by Suhir...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 520–526.
Published Online: December 15, 2003
... moulding polymers internal stresses thermal stresses finite element analysis creep viscoelasticity At present, thermo-mechanical reliability of integrated circuit (IC) packages is still one of the major concerns in the electronic industry. Critical stress levels may be induced in the package...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 134–138.
Published Online: March 14, 2003
...Yujun Wen, PhD candidate; Cemal Basaran, Assoc. Prof. and Director An accurate estimate of thermal stresses in multilayered microelectronics structures along the bonded interfaces is crucial for design and prediction of delamination-related failures. Compared with a numerical method, analytical...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 379–384.
Published Online: December 12, 2002
... transmitters transceivers corrosion testing metallography humidity thermal stresses zinc alloys aluminium alloys copper alloys telecommunication equipment testing The small-form pluggable (SFP) transceivers 1 2 are a family of DC low-power (3.3V) and low-cost small form factor (SFF) fiber...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 141–146.
Published Online: July 26, 2002
...C. Q. Ru A simple non-local modified beam model is presented to evaluate interfacial thermal stresses in bimaterial elastic beams. The model has its root in an earlier model (Suhir 1986) which assumes that the longitudinal interfacial displacement at a point depends on the interfacial shear stress...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 310–313.
Published Online: July 26, 2002
... integrated circuit interconnections electronic speckle pattern interferometry scanning electron microscopy flip-chip devices integrated circuit packaging displacement measurement strain measurement thermal stresses thermal expansion integrated circuit reliability image processing One...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 292–297.
Published Online: July 26, 2002
... alloys soldering creep slip nucleation voids (solid) fatigue thermal stresses stress analysis viscoplasticity stress relaxation Eutectic Pb-Sn solder used in electronic packaging applications is known to be highly viscoplastic in use environments because of the high homologous...