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Keywords: thermal vias
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011006.
Paper No: EP-14-1013
Published Online: October 6, 2014
... the peak temperature in package and energy efficiency of the cooling system can be significantly improved through the optimization of TECs. TECs are also compared against a configuration where they are replaced by copper blocks or thermal vias. A total of 4.7 °C of additional localized cooling is observed...
