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Keywords: titanium compounds
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041007.
Published Online: December 9, 2011
... 2011 09 12 2011 09 12 2011 alumina bonding processes deformation foils gold scanning electron microscopy shear strength silver solders titanium compounds fluxless bonding solid state bonding silver alumina Alumina has continued to be a favorite choice...
