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Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011003.
Published Online: February 11, 2009
...M. A. Neidigk; Y.-L. Shen The generation of thermal stresses is a major cause for mechanical failure in encapsulated electronic components. In this study numerical modeling is employed to analyze thermal stresses in a high-voltage transformer encapsulated with filled epoxy. The transformer assembly...