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Keywords: ultrasonic materials testing
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Journal Articles

Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System

Jin Yang, Lizheng Zhang, I. Charles Ume, Camil Ghiu, George White
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021006.
https://doi.org/10.1115/1.4001832
Published Online: June 23, 2010
... of laser ultrasound signals. 01 06 2009 22 04 2010 23 06 2010 23 06 2010 cracks electronics packaging reliability solders ultrasonic materials testing X-ray applications land grid array (LGA) solder joint laser ultrasound thermal reliability Based...
View Article titled, Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System
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Topics: Cycles, Inspection, Lasers, Reliability, Solder joints, Ultrasound, X-rays, Fracture (Materials)
Journal Articles

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

Z. Q. Yu, Y. C. Chan, D. P. Webb, G. Y. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 172–177.
https://doi.org/10.1115/1.483151
Published Online: May 21, 1999
... ultrasonic materials testing flaw detection thermal stress cracking voids (solid) acoustic tomography Ceramic substrates play an extremely important role in electronic packages. Low temperature cofired ceramic (LTCC) technology has the ability to integrate passive components such as capacitors...
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Topics: Acoustics, Capacitors, Ceramics, Delamination, Nondestructive evaluation, Testing, Microscopy, Thermal shock, Reliability, Failure analysis
Journal Articles

A Novel High Performance Die Attach for Ceramic Packages

J. Z. Shi, X. M. Xie, F. Stubhan, J. Freytag
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 168–171.
https://doi.org/10.1115/1.483150
Published Online: March 15, 1999
... PACKAGING . Manuscript received by the EEPD March 15, 1999. Associate Technical Editor: B. Michel. 15 March 1999 ceramic packaging microassembling integrated circuit bonding solidification shear strength mechanical testing metallography ultrasonic materials testing acoustic...
View Article titled, A Novel High Performance Die Attach for Ceramic Packages
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Topics: Bonding, Ceramics, Cycles, Shear strength, Solidification, Temperature