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Keywords: unstable void growth
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031011.
Published Online: July 31, 2009
... growth. The critical stress is found to be in the same order of Young’s modulus of the film when initial void volume fraction is between 0.01 and 0.05 ( 15 16 ). Although a single finite spherical void model is too simple, it shed light on the mechanism of unstable void growth within the context...