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Journal Articles

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages

B. Xie, X. J. Fan, X. Q. Shi, H. Ding
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031011.
https://doi.org/10.1115/1.3144154
Published Online: July 31, 2009
...B. Xie; X. J. Fan; X. Q. Shi; H. Ding In the present study, the direct concentration approach (DCA) and the whole-field vapor pressure model developed in Part I of this work ( Xie et al., 2009 “Direct Concentration Approach of Moisture Diffusion and Whole Field Vapor Pressure Modeling for Reflow...
View Articletitled, Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages
Open the PDF for Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages in another window
Topics: Diffusion (Physics), Vapor pressure, Failure, Modeling
Journal Articles

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

B. Xie, X. J. Fan, X. Q. Shi, H. Ding
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031010.
https://doi.org/10.1115/1.3144147
Published Online: July 31, 2009
... the moisture concentration is used as a field variable directly. Constraint equations are applied to meet the interface continuity requirements. Further in this paper, a simplified vapor pressure model based on a multiscale analysis is developed. The model considers the phase change in moisture, and links...
View Articletitled, Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation
Open the PDF for Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation in another window
Topics: Diffusion (Physics), Modeling, Temperature, Vapor pressure, Electronic packages