This paper deals with the continuous chemical vapor deposition of silicon in a horizontal cold wall reactor, paying special attention to a moving susceptor. A two-dimensional numerical model, which accounts for variable properties, thermal diffusion, radiative heat exchange among surfaces, and conjugate heat transfer between the gas and susceptor, is developed and validated. Scale analysis for the susceptor energy balance enables the identification of the characteristic parameters and the prediction of their qualitative effects before carrying out a detailed analysis. The results from the scale analysis are found to be consistent with the numerical predictions. The results show that the present continuous system is characterized by two newly defined parameters: conductance ratio and susceptor parameter. A pair of performance curves that relate the deposition efficiency to each parameter successfully provide the susceptor-related design conditions. It is also revealed that there exists an optimum length of heating zone that maximizes the deposition efficiency.
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Thermal Aspects in the Continuous Chemical Vapor Deposition of Silicon
Hoseon Yoo,
Hoseon Yoo
Department of Mechanical Engineering, Soongsil University, Seoul 156-743, Korea
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Yogesh Jaluria, Fellow ASME
e-mail: jaluria@jove.rutgers.edu
Yogesh Jaluria, Fellow ASME
Department of Mechanical and Aerospace Engineering, Rutgers, The State University of New Jersey, New Brunswick, NJ 08854
Search for other works by this author on:
Hoseon Yoo
Department of Mechanical Engineering, Soongsil University, Seoul 156-743, Korea
Yogesh Jaluria, Fellow ASME
Department of Mechanical and Aerospace Engineering, Rutgers, The State University of New Jersey, New Brunswick, NJ 08854
e-mail: jaluria@jove.rutgers.edu
Contributed by the Heat Transfer Division for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division August 17, 2001; revision received March 19, 2002. Associate Editor: C. Amon.
J. Heat Transfer. Oct 2002, 124(5): 938-946 (9 pages)
Published Online: September 11, 2002
Article history
Received:
August 17, 2001
Revised:
March 19, 2002
Online:
September 11, 2002
Citation
Yoo, H., and Jaluria, Y. (September 11, 2002). "Thermal Aspects in the Continuous Chemical Vapor Deposition of Silicon ." ASME. J. Heat Transfer. October 2002; 124(5): 938–946. https://doi.org/10.1115/1.1482084
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