Direct cooling by means of jets and sprays has been considered as a solution to the problem of cooling of high power density electronic devices. Although both methods are capable of very high heat removal rates no criterion exists that helps one decide as to which one is preferable, when designing a cooling system for electronic applications. In this work, the results of an investigation of the performances of sprays and arrays of micro jets are reported. Experiments have been conducted using HAGO nozzles and orifice plates to create droplet sprays and arrays of micro jets, respectively. The liquid jets had diameters ranging from 69 to 250 μm and the pitches between the jets were 1, 2, and 3 mm. The test fluid was deionized water and the jet Reynolds number ranged between 43 and 3813. A comparison of heat transfer and pressure drop results obtained employing both sprays and jets has been carried out. The microjet arrays proved superior to the sprays since they required less pumping power per unit of power removed. A cooling module employing impinging jets was tested. Such a module would require three primary components: an orifice plate for forming jets or a nozzle to form the spray; a container to hold the nozzle, the heat source and the cooling liquid, which also serves as a heat exchanger to the ambient; and a pump which recirculates the coolant. A fan could be used to improve the heat transfer to the ambient, and it would allow the use of a smaller container. An impinging jets cooling module has been designed and tested. Heat fluxes as high as 300 W/cm2 at 80°C surface temperature could be removed using a system which includes a 4×6 array of microjets of water of 140 μm diameter impinging on a diode 5.0×8.7 mm2.
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A Comparative Study of Cooling of High Power Density Electronics Using Sprays and Microjets
Matteo Fabbri,
Matteo Fabbri
Mechanical and Aerospace Engineering Department, Henry Samueli School of Engineering and Applied Science, University of California Los Angeles, 420 Westwood Plaza, Los Angeles, CA 90095
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Shanjuan Jiang,
Shanjuan Jiang
Mechanical and Aerospace Engineering Department, Henry Samueli School of Engineering and Applied Science, University of California Los Angeles, 420 Westwood Plaza, Los Angeles, CA 90095
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Vijay K. Dhir
e-mail: vdhir@seas.ucla.edu
Vijay K. Dhir
Mechanical and Aerospace Engineering Department, Henry Samueli School of Engineering and Applied Science, University of California Los Angeles, 420 Westwood Plaza, Los Angeles, CA 90095
Search for other works by this author on:
Matteo Fabbri
Mechanical and Aerospace Engineering Department, Henry Samueli School of Engineering and Applied Science, University of California Los Angeles, 420 Westwood Plaza, Los Angeles, CA 90095
Shanjuan Jiang
Mechanical and Aerospace Engineering Department, Henry Samueli School of Engineering and Applied Science, University of California Los Angeles, 420 Westwood Plaza, Los Angeles, CA 90095
Vijay K. Dhir
Mechanical and Aerospace Engineering Department, Henry Samueli School of Engineering and Applied Science, University of California Los Angeles, 420 Westwood Plaza, Los Angeles, CA 90095
e-mail: vdhir@seas.ucla.edu
Contributed by the Heat Transfer Division for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division May 12, 2004; revision received July 24, 2004. Associate Editor: C. Amon.
J. Heat Transfer. Jan 2005, 127(1): 38-48 (11 pages)
Published Online: February 15, 2005
Article history
Received:
May 12, 2004
Revised:
July 24, 2004
Online:
February 15, 2005
Citation
Fabbri , M., Jiang , S., and Dhir, V. K. (February 15, 2005). "A Comparative Study of Cooling of High Power Density Electronics Using Sprays and Microjets ." ASME. J. Heat Transfer. January 2005; 127(1): 38–48. https://doi.org/10.1115/1.1804205
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