Today’s electronic and optoelectronic devices are plagued by heat transfer issues. As device dimensions shrink and operating frequencies increase, ever-increasing amounts of thermal energy are being generated in smaller and smaller volumes. As devices shrink to length scales on the order of carrier mean free paths, thermal transport is no longer dictated by the thermal properties of the materials comprising the devices, but rather the transport of energy across the interfaces between adjacent materials in the devices. In this paper, current theories and experiments concerning phonon scattering processes driving thermal boundary conductance are reviewed. Experimental studies of thermal boundary conductance conducted with the transient thermoreflectance technique challenging specific assumptions about phonon scattering during thermal boundary conductance are presented. To examine the effects of atomic mixing at the interface on , a series of Cr/Si samples was fabricated subject to different deposition conditions. The varying degrees of atomic mixing were measured with Auger electron spectroscopy. Phonon scattering phenomena in the presence of interfacial mixing were observed with the trends in the Cr/Si . The experimental results are reviewed and a virtual crystal diffuse mismatch model is presented to add insight into the effect of interatomic mixing at the interface. The assumption that phonons can only transmit energy across the interface by scattering with a phonon of the same frequency—i.e., elastic scattering, can lead to underpredictions of by almost an order of magnitude. To examine the effects of inelastic scattering on , a series of metal/dielectric interfaces with a wide range of vibrational similarity is studied at temperatures above and around materials’ Debye temperatures. Inelastic scattering is observed and new models are developed to predict and its relative dependency on elastic and inelastic scattering events.
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Micro/Nanoscale Heat Transfer—Part Ii
Examining Interfacial Diffuse Phonon Scattering Through Transient Thermoreflectance Measurements of Thermal Boundary Conductance
Pamela M. Norris,
Pamela M. Norris
Department of Mechanical and Aerospace Engineering,
e-mail: pamela@virginia.edu
University of Virginia
, P.O. Box 400746, Charlottesville, VA 22904-4746
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Patrick E. Hopkins
Patrick E. Hopkins
Department of Mechanical and Aerospace Engineering,
University of Virginia
, P.O. Box 400746, Charlottesville, VA 22904-4746
Search for other works by this author on:
Pamela M. Norris
Department of Mechanical and Aerospace Engineering,
University of Virginia
, P.O. Box 400746, Charlottesville, VA 22904-4746e-mail: pamela@virginia.edu
Patrick E. Hopkins
Department of Mechanical and Aerospace Engineering,
University of Virginia
, P.O. Box 400746, Charlottesville, VA 22904-4746J. Heat Transfer. Apr 2009, 131(4): 043207 (11 pages)
Published Online: February 20, 2009
Article history
Received:
June 12, 2008
Revised:
October 8, 2008
Published:
February 20, 2009
Citation
Norris, P. M., and Hopkins, P. E. (February 20, 2009). "Examining Interfacial Diffuse Phonon Scattering Through Transient Thermoreflectance Measurements of Thermal Boundary Conductance." ASME. J. Heat Transfer. April 2009; 131(4): 043207. https://doi.org/10.1115/1.3072928
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