This paper focuses on two forced convection methods—steady jet flow and pulsating flow by synthetic jets—that can be used in applications requiring significant amounts of heat removal from electronics components. Given the dearth of available data, we have experimentally investigated steady jets and piezoelectrically driven synthetic jets that provide pulsating flow of air at a high coefficient of performance. To mimic a typical electronics component, a 25.4-mm × 25.4-mm vertical heated surface was used for heat removal. The impingement heat transfer, in the form of Nusselt number, is reported for both steady and unsteady jets over Reynolds numbers from 100 to 3000. The effect of jet-to-plate surface distance on the impingement heat transfer is also investigated. Our results show that synthetic jets can provide significantly higher cooling than steady jets in the Reynolds number range of 100 to 3000. We attribute the superior performance of synthetic jets to vortex shedding associated with the unsteady flow.
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November 2013
This article was originally published in
Journal of Heat Transfer
Research-Article
Steady and Unsteady Air Impingement Heat Transfer for Electronics Cooling Applications
Mehmet Arik,
Mehmet Arik
Faculty of Engineering,
Department of Mechanical Engineering,
e-mail: mehmet.arik@ozyegin.edu.tr
Department of Mechanical Engineering,
Ozyegin University Cekmekoy
,34782 Istanbul
, Turkey
e-mail: mehmet.arik@ozyegin.edu.tr
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Rajdeep Sharma,
Rajdeep Sharma
Exponent Inc.
,Menlo Park, CA 94025
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Xin He
Golden, CO 80401
Xin He
National Renewable Energy Laboratory
,Golden, CO 80401
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Mehmet Arik
Faculty of Engineering,
Department of Mechanical Engineering,
e-mail: mehmet.arik@ozyegin.edu.tr
Department of Mechanical Engineering,
Ozyegin University Cekmekoy
,34782 Istanbul
, Turkey
e-mail: mehmet.arik@ozyegin.edu.tr
Rajdeep Sharma
Exponent Inc.
,Menlo Park, CA 94025
Xin He
National Renewable Energy Laboratory
,Golden, CO 80401
Contributed by the Heat Transfer Division of ASME for publication in the Journal of Heat Transfer. Manuscript received April 25, 2012; final manuscript received December 22, 2012; published online September 23, 2013. Assoc. Sujoy Kumar Saha.
J. Heat Transfer. Nov 2013, 135(11): 111009 (8 pages)
Published Online: September 23, 2013
Article history
Received:
April 25, 2012
Revision Received:
December 22, 2012
Citation
Arik, M., Sharma, R., Lustbader, J., and He, X. (September 23, 2013). "Steady and Unsteady Air Impingement Heat Transfer for Electronics Cooling Applications." ASME. J. Heat Transfer. November 2013; 135(11): 111009. https://doi.org/10.1115/1.4024614
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