Coaxial thermocouple sensors are suitable for measuring highly transient surface heat fluxes because the response times of these sensors are very small (∼0.1 ms). These robust sensors have the flexibility of mounting them directly on the surface of any geometry. So, they have been routinely used in ground-based impulse facilities as temperature sensors where rapid changes in heat loads are expected on aerodynamic models. Subsequently, the surface heat fluxes are predicted from the transient temperatures by appropriate one-dimensional heat conduction modeling for semi-infinite body. In this backdrop, the purpose of this work is to design and fabricate K-type coaxial thermocouples in-house and calibrate them under similar nature of heat loads by using simple laboratory instruments. Here, two methods of dynamic calibration of coaxial thermocouples have been discussed, where the known step loads are applied through radiation and conduction modes of heat transfer. Using appropriate one dimensional heat conduction modeling, the surface heat fluxes are predicted from the measured temperature histories and subsequently compared with the input heat loads. The recovery of surface heat flux from laser based calibration experiment under-predicts by 4% from its true input heat load. Similarly, recovery of surface heat flux from the conduction mode calibration experiments under-predicts 6% from its true input value. Further, finite-element based numerical study is performed on the coaxial thermocouple model to obtain surface temperatures with same heat loads as used in the experiments. The recovery of surface temperatures from finite element simulation is achieved within an accuracy of ±0.3% from the experiment.
Skip Nav Destination
Article navigation
December 2013
This article was originally published in
Journal of Heat Transfer
Technical Briefs
Dynamic Calibration of a Coaxial Thermocouples for Short Duration Transient Measurements
Niranjan Sahoo
Niranjan Sahoo
1
Associate Professor
e-mail: shock@iitg.ernet.in
Department of Mechanical Engineering,
e-mail: shock@iitg.ernet.in
Department of Mechanical Engineering,
Indian Institute of Technology Guwahati
,Guwahati 781 039
, India
1Corresponding author.
Search for other works by this author on:
Rakesh Kumar
Research Scholar
Niranjan Sahoo
Associate Professor
e-mail: shock@iitg.ernet.in
Department of Mechanical Engineering,
e-mail: shock@iitg.ernet.in
Department of Mechanical Engineering,
Indian Institute of Technology Guwahati
,Guwahati 781 039
, India
1Corresponding author.
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received May 31, 2012; final manuscript received May 5, 2013; published online September 27, 2013. Assoc. Editor: Oronzio Manca.
J. Heat Transfer. Dec 2013, 135(12): 124502 (7 pages)
Published Online: September 27, 2013
Article history
Received:
May 31, 2012
Revision Received:
May 5, 2013
Citation
Kumar, R., and Sahoo, N. (September 27, 2013). "Dynamic Calibration of a Coaxial Thermocouples for Short Duration Transient Measurements." ASME. J. Heat Transfer. December 2013; 135(12): 124502. https://doi.org/10.1115/1.4024593
Download citation file:
Get Email Alerts
Cited By
Related Articles
Comparative Performance of K, E, and J-Type Fast Response Coaxial Probes for Short-Period Transient Measurements
J. Thermal Sci. Eng. Appl (June,2021)
Design of Micro-Temperature Sensor Array With Thin Film Thermocouples
J. Electron. Packag (September,2005)
Development of Ni Cr ∕ Ni Si Thin-Film Thermocouple Sensor for Workpiece Temperature Measurement in Chemical Explosive Material Machining
J. Manuf. Sci. Eng (February,2006)
Influence of Thermal Effects on Hole Quality in Dry Drilling, Part 1: A Thermal Model of Workpiece Temperatures
J. Manuf. Sci. Eng (May,2002)
Related Proceedings Papers
Related Chapters
Resistance Mythology
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Thermotriples
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
How to Use this Book
Thermal Spreading and Contact Resistance: Fundamentals and Applications