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J. Heat Transfer. April 2005, 127(4): 357. doi: https://doi.org/10.1115/1.1869516

Research Paper

J. Heat Transfer. April 2005, 127(4): 358–365. doi: https://doi.org/10.1115/1.1800493
J. Heat Transfer. April 2005, 127(4): 366–377. doi: https://doi.org/10.1115/1.1844537
J. Heat Transfer. April 2005, 127(4): 378–387. doi: https://doi.org/10.1115/1.1860564
J. Heat Transfer. April 2005, 127(4): 388–392. doi: https://doi.org/10.1115/1.1860565
J. Heat Transfer. April 2005, 127(4): 393–403. doi: https://doi.org/10.1115/1.1861920
J. Heat Transfer. April 2005, 127(4): 404–413. doi: https://doi.org/10.1115/1.1861922
J. Heat Transfer. April 2005, 127(4): 414–424. doi: https://doi.org/10.1115/1.1861923
J. Heat Transfer. April 2005, 127(4): 425–433. doi: https://doi.org/10.1115/1.1865220

Technical Note

J. Heat Transfer. April 2005, 127(4): 434–440. doi: https://doi.org/10.1115/1.1865222

Technology Review

J. Heat Transfer. April 2005, 127(4): 441–453. doi: https://doi.org/10.1115/1.1860562
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