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Journal Articles

Numerical Simulation of Mixed Convection Cooling of Electronic Component Within a Lid-Driven Cubic Cavity Filled With Nanofluid

Nouari Soufiane, Ait Hssain Mustapha, Lafdaili Zakaria, El-hamdani Sakina, Doghmi Hicham

Publisher: ASME

J. Heat Mass Transfer. September 2023, 145(9): 091502.

Paper No: HT-22-1708

https://doi.org/10.1115/1.4062564

Published Online: May 31, 2023

View Article titled, Numerical Simulation of Mixed Convection Cooling of Electronic Component Within a Lid-Driven Cubic Cavity Filled With Nanofluid

Topics: Cavities, Cooling, Heat transfer, Mixed convection, Nanofluids, Nanoparticles, Boundary-value problems, Temperature, Computer simulation, Shapes

Journal Articles

Thermal-Hydraulic Performance of Circular Electronic Components With Parabolic and Hyperbolic Front Facing the Upstream Flow

Ashwin Mahendra, Rajendran Senthil Kumar

Publisher: ASME

J. Heat Mass Transfer. January 2021, 143(1): 011501.

Paper No: HT-19-1705

https://doi.org/10.1115/1.4048623

Published Online: November 4, 2020

View Article titled, Thermal-Hydraulic Performance of Circular Electronic Components With Parabolic and Hyperbolic Front Facing the Upstream Flow

Topics: Drag (Fluid dynamics), Electronic components, Flow (Dynamics), Fluids, Heat transfer, Reynolds number, Pressure drop, Shapes, Cylinders, Pressure

Journal Articles

Modeling Alkaline Liquid Metal (Na) Evaporating Thin Films Using Both Retarded Dispersion and Electronic Force Components

Joseph B. Tipton, Jr., Kenneth D. Kihm, David M. Pratt

Publisher: ASME

J. Heat Mass Transfer. December 2009, 131(12): 121015.

https://doi.org/10.1115/1.4000022

Published Online: October 15, 2009

View Article titled, Modeling Alkaline Liquid Metal (Na) Evaporating Thin Films Using Both Retarded Dispersion and Electronic Force Components

Topics: Electronic components, Evaporation, Liquid metals, Pressure, Sodium, Thin films, Work function (Physics), Modeling, Boundary-value problems, Electrons

Journal Articles

Autonomous Thermal Control System for Highly Variable Environments

G. A. Richardson

Publisher: ASME

J. Heat Mass Transfer. June 2009, 131(6): 064505.

https://doi.org/10.1115/1.3085826

Published Online: April 13, 2009

View Article titled, Autonomous Thermal Control System for Highly Variable Environments

Topics: Control systems, Cooling, Design, Electronic components, Heat conduction, Instrumentation, Temperature, Temperature sensors, Thermal management, Thermoelectric coolers

Journal Articles

Experimental and Numerical Investigation of Forced Convective Characteristics of Arrays of Channel Mounted Obstacles

T. J. Young, K. Vafai

Publisher: ASME

J. Heat Mass Transfer. February 1999, 121(1): 34–42.

https://doi.org/10.1115/1.2825962

Published Online: February 1, 1999

View Article titled, Experimental and Numerical Investigation of Forced Convective Characteristics of Arrays of Channel Mounted Obstacles

Topics: Air flow, Computer simulation, Convection, Cooling, Electronic components, Electronics, Failure, Flow (Dynamics), Flux (Metallurgy), Heat

Journal Articles

Predictions of Turbulent Heat Transfer in an Axisymmetric Jet Impinging on a Heated Pedestal

S. Parneix, M. Behnia, P. A. Durbin

Publisher: ASME

J. Heat Mass Transfer. February 1999, 121(1): 43–49.

https://doi.org/10.1115/1.2825964

Published Online: February 1, 1999

View Article titled, Predictions of Turbulent Heat Transfer in an Axisymmetric Jet Impinging on a Heated Pedestal

Topics: Computers, Cooling, Electronic components, Engineering systems and industry applications, Flat plates, Geometry, Heat transfer coefficients, Heating, Jets, Modeling

Journal Articles

Transport Phenomena in Picoliter Size Solder Droplet Dispension

J. M. Waldvogel, D. Poulikakos, D. B. Wallace, R. Marusak

Publisher: ASME

J. Heat Mass Transfer. February 1996, 118(1): 148–156.

https://doi.org/10.1115/1.2824028

Published Online: February 1, 1996

View Article titled, Transport Phenomena in Picoliter Size Solder Droplet Dispension

Topics: Drops, Heat transfer, Solders, Transport phenomena, Computer simulation, Temperature, Composite materials, Convection, Deformation, Electronic components

Journal Articles

A Correlation for Heat Transfer and Wake Effect in the Entrance Region of an In-Line Array of Rectangular Blocks Simulating Electronic Components

M. Molki, M. Faghri, O. Ozbay

Publisher: ASME

J. Heat Mass Transfer. February 1995, 117(1): 40–46.

https://doi.org/10.1115/1.2822320

Published Online: February 1, 1995

View Article titled, A Correlation for Heat Transfer and Wake Effect in the Entrance Region of an In-Line Array of Rectangular Blocks Simulating Electronic Components

Topics: Electronic components, Entrance region, Heat transfer, Wakes, Fluids, Heat transfer coefficients, Temperature, Computers, Electronic equipment, Engineers

Journal Articles

Mixed Convection From Simulated Electronic Components at Varying Relative Positions in a Cavity

E. Papanicolaou, Y. Jaluria

Publisher: ASME

J. Heat Mass Transfer. November 1994, 116(4): 960–970.

https://doi.org/10.1115/1.2911472

Published Online: November 1, 1994

View Article titled, Mixed Convection From Simulated Electronic Components at Varying Relative Positions in a Cavity

Topics: Cavities, Electronic components, Heat transfer, Mixed convection

Journal Articles

Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing

A. M. Anderson, R. J. Moffat

Publisher: ASME

J. Heat Mass Transfer. February 1991, 113(1): 56–62.

https://doi.org/10.1115/1.2910551

Published Online: February 1, 1991

View Article titled, Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing

Topics: Cooling, Electronic components, Forced convection, Temperature, Fluids, Heating, Pressure drop, Computer cooling, Coolants, Electronic equipment

Journal Articles

Interaction of Natural Convection Wakes Arising From Thermal Sources on a Vertical Surface

Y. Jaluria

Publisher: ASME

J. Heat Mass Transfer. November 1985, 107(4): 883–892.

https://doi.org/10.1115/1.3247517

Published Online: November 1, 1985

View Article titled, Interaction of Natural Convection Wakes Arising From Thermal Sources on a Vertical Surface

Topics: Natural convection, Wakes, Flow (Dynamics), Heat, Boundary layers, Electronic components, Plumes (Fluid dynamics), Boundary-value problems, Finite difference methods, Heat transfer

Journal citation

NARROW

Numerical Simulation of Mixed Convection Cooling of Electronic Component Within a Lid-Driven Cubic Cavity Filled With Nanofluid

Thermal-Hydraulic Performance of Circular Electronic Components With Parabolic and Hyperbolic Front Facing the Upstream Flow

Modeling Alkaline Liquid Metal (Na) Evaporating Thin Films Using Both Retarded Dispersion and Electronic Force Components

Autonomous Thermal Control System for Highly Variable Environments

Experimental and Numerical Investigation of Forced Convective Characteristics of Arrays of Channel Mounted Obstacles

Predictions of Turbulent Heat Transfer in an Axisymmetric Jet Impinging on a Heated Pedestal

Transport Phenomena in Picoliter Size Solder Droplet Dispension

A Correlation for Heat Transfer and Wake Effect in the Entrance Region of an In-Line Array of Rectangular Blocks Simulating Electronic Components

Mixed Convection From Simulated Electronic Components at Varying Relative Positions in a Cavity

Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing

Interaction of Natural Convection Wakes Arising From Thermal Sources on a Vertical Surface

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