... effective method of improving thermal conductivity was suggested. References 1 Chung , D. D. L. , 2001 , “ Thermal Interface Materials ,” J. Mater. Eng. Perform. , 10 , pp. 56 – 59 . 10.1361/105994901770345358 2 Gwinn , J. P. , and Webb , R. L. , 2003 , “ Performance...

... thermal management (packaging) thermal resistance carbon nanotube thermal interface material contact thermal resistance plasma CVD low temperature photoacoustic As semiconductor technology continues to advance, resulting in progressive reductions of device feature sizes and expansion...

...M. A. Panzer; G. Zhang; D. Mann; X. Hu; E. Pop; H. Dai; K. E. Goodson Owing to their high thermal conductivities, carbon nanotubes (CNTs) are promising for use in advanced thermal interface materials. While there has been much previous research on the properties of isolated CNTs, there are few...

... temperature. Hu et al. ( 8 ) proposed the combined use of CNTs and traditional heat conductive fillers for thermal interface materials (TIMs), achieving a thermal conductivity value seven times that of the base fluid, and almost doubling the thermal conductivity of the corresponding TIM composed of only...

... carbon nanotubes silicon elemental semiconductors thermal conductivity contact resistance thermal resistance voids (solid) thermal management (packaging) thermal conductivity contact thermal resistance carbon nanotube thermal interface material 3-omega method thermal management...