Recently, orthogonal cutting has been exploited as a means for producing ultrafine grained (UFG) and nanocrystalline microstructures for various metal materials, such as aluminum alloys, copper, stainless steel, titanium and nickel-based super alloys, etc. However, no predictive, analytical or numerical work has ever been presented to quantitatively predict the change of grain sizes during plane-strain orthogonal cutting. In this paper, a dislocation density-based material plasticity model is adapted for modeling the grain size refinement mechanism during orthogonal cutting by means of a finite element based numerical framework. A coupled Eulerian–Lagrangian (CEL) finite element model embedded with the dislocation density subroutine is developed to model the severe plastic deformation and grain refinement during a steady-state cutting process. The orthogonal cutting tests of a commercially pure titanium (CP Ti) material are simulated in order to assess the validity of the numerical solution through comparison with experiments. The dislocation density-based material plasticity model is calibrated to reproduce the observed material constitutive mechanical behavior of CP Ti under various strains, strain rates, and temperatures in the cutting process. It is shown that the developed model captures the essential features of the material mechanical behavior and predicts a grain size of 100–160 nm in the chips of CP Ti at a cutting speed of 10 mm/s.
Skip Nav Destination
Article navigation
August 2014
Research-Article
Dislocation Density-Based Grain Refinement Modeling of Orthogonal Cutting of Titanium
Hongtao Ding,
Hongtao Ding
Department of Mechanical and
Industrial Engineering,
Industrial Engineering,
The University of Iowa
,Iowa City, IA 52242
Search for other works by this author on:
Yung C. Shin
Yung C. Shin
1
Fellow ASME
School of Mechanical Engineering,
e-mail:
School of Mechanical Engineering,
Purdue University
,West Lafayette, IN 47907
e-mail:
shin@purdue.edu
1Corresponding author.
Search for other works by this author on:
Hongtao Ding
Department of Mechanical and
Industrial Engineering,
Industrial Engineering,
The University of Iowa
,Iowa City, IA 52242
Yung C. Shin
Fellow ASME
School of Mechanical Engineering,
e-mail:
School of Mechanical Engineering,
Purdue University
,West Lafayette, IN 47907
e-mail:
shin@purdue.edu
1Corresponding author.
Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received October 1, 2011; final manuscript received March 12, 2014; published online May 21, 2014. Assoc. Editor: Burak Ozdoganlar.
J. Manuf. Sci. Eng. Aug 2014, 136(4): 041003 (11 pages)
Published Online: May 21, 2014
Article history
Received:
October 1, 2011
Revision Received:
March 12, 2014
Citation
Ding, H., and Shin, Y. C. (May 21, 2014). "Dislocation Density-Based Grain Refinement Modeling of Orthogonal Cutting of Titanium." ASME. J. Manuf. Sci. Eng. August 2014; 136(4): 041003. https://doi.org/10.1115/1.4027207
Download citation file:
Get Email Alerts
Related Articles
Dislocation Density and Grain Size Evolution in the Machining of Al6061-T6 Alloys
J. Manuf. Sci. Eng (August,2014)
Experimental Investigation of Grain and Specimen Size Effects During Electrical-Assisted Forming
J. Manuf. Sci. Eng (April,2010)
Inelastic Contact Behavior of Crystalline Asperities in rf MEMS Devices
J. Eng. Mater. Technol (January,2009)
Study of Machining-Induced Microstructure Variations of Nanostructured/Ultrafine-Grained Copper Using XRD
J. Eng. Mater. Technol (April,2011)
Related Proceedings Papers
Related Chapters
Preparation of TiC Nanopowder by Mechanical Alloying Process
International Conference on Mechanical and Electrical Technology, 3rd, (ICMET-China 2011), Volumes 1–3
The Effect of Temperature on the Irradiation Growth of Cold-Worked Zr-2.5 Nb
Zirconium in the Nuclear Industry: Eighth International Symposium
The Effect of Temperature on Polymer Supported Titanium Dioxide Photocatalyst for Degradation of Volatile Organic Compounds
International Conference on Computer and Electrical Engineering 4th (ICCEE 2011)