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Journal Articles

Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints

Shugo Miyake, Kohei Ohtani, Shozo Inoue, Takahiro Namazu
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research-Article
J. Eng. Mater. Technol. January 2016, 138(1): 011006.
Paper No: MATS-15-1128
https://doi.org/10.1115/1.4032020
Published Online: December 8, 2015
View Article titled, Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints
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Topics: Bonding, Fracture (Materials), Fracture (Process), Fracture toughness, Pressure, Reliability, Solder joints, Solders, Stress, Vacuum
Journal Articles

Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints

Takahiro Namazu, Kohei Ohtani, Shozo Inoue, Shugo Miyake
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research-Article
J. Eng. Mater. Technol. July 2015, 137(3): 031011.
Paper No: MATS-14-1250
https://doi.org/10.1115/1.4030413
Published Online: July 1, 2015
View Article titled, Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints
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Topics: Fracture (Materials), Fracture (Process), Metals, Solder joints, Solders, Stress, Bonding, Pressure
Journal Articles

Crack Initiation and Growth in Solder Joints Under Cyclic Shear Deformation Using Piezomechanical Actuation

Dong-Jin Shim, S. Mark Spearing, Qingda Yang
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2007, 129(1): 19–28.
https://doi.org/10.1115/1.2400257
Published Online: December 6, 2005
View Article titled, Crack Initiation and Growth in Solder Joints Under Cyclic Shear Deformation Using Piezomechanical Actuation
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Topics: Fracture (Materials), Piezoelectric ceramics, Shear (Mechanics), Solder joints, Solders, Shear deformation, Plates (structures)
Journal Articles

A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints

E. P. Busso, M. Kitano, T. Kumazawa
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. July 1992, 114(3): 331–337.
https://doi.org/10.1115/1.2904181
Published Online: July 1, 1992
View Article titled, A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints
Open the PDF for A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints in another window
Topics: Constitutive equations, Solders, Deformation, Hardening, Steady state, Stress, Continuum mechanics, Creep, Finite element analysis, Lead alloys