A computational model to investigate the flushing of electric discharge machining (EDM) debris from the interelectrode gap during the spray-EDM process is developed. Spray-EDM differs from conventional EDM in that an atomized dielectric spray is used to generate a thin film that penetrates the interelectrode gap. The debris flushing in spray-EDM is investigated by developing models for three processes, viz., dielectric spray formation, film formation, and debris flushing. The range of spray system parameters including gas pressure and impingement angle that ensure formation of dielectric film on the surface is identified followed by the determination of dielectric film thickness and velocity. The debris flushing in conventional EDM with stationary dielectric and spray-EDM processes is then compared. It is observed that the dielectric film thickness and velocity play a significant role in removing the debris particles from the machining region. The model is used to determine the spray conditions that result in enhanced debris flushing with spray-EDM.
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September 2016
This article was originally published in
Journal of Micro and Nano-Manufacturing
Research-Article
A Computational Model to Study Film Formation and Debris Flushing Phenomena in Spray-Electric Discharge Machining
Arvind Pattabhiraman,
Arvind Pattabhiraman
Department of Mechanical Science
and Engineering,
University of Illinois at Urbana-Champaign,
Urbana, IL 61801
and Engineering,
University of Illinois at Urbana-Champaign,
Urbana, IL 61801
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Deepak Marla,
Deepak Marla
Department of Mechanical Science
and Engineering,
University of Illinois at Urbana-Champaign,
Urbana, IL 61801
and Engineering,
University of Illinois at Urbana-Champaign,
Urbana, IL 61801
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Shiv G. Kapoor
Shiv G. Kapoor
Professor
Department of Mechanical Science and Engineering,
University of Illinois at Urbana-Champaign,
Urbana, IL 61801
e-mail: sgkapoor@illinois.edu
Department of Mechanical Science and Engineering,
University of Illinois at Urbana-Champaign,
Urbana, IL 61801
e-mail: sgkapoor@illinois.edu
Search for other works by this author on:
Arvind Pattabhiraman
Department of Mechanical Science
and Engineering,
University of Illinois at Urbana-Champaign,
Urbana, IL 61801
and Engineering,
University of Illinois at Urbana-Champaign,
Urbana, IL 61801
Deepak Marla
Department of Mechanical Science
and Engineering,
University of Illinois at Urbana-Champaign,
Urbana, IL 61801
and Engineering,
University of Illinois at Urbana-Champaign,
Urbana, IL 61801
Shiv G. Kapoor
Professor
Department of Mechanical Science and Engineering,
University of Illinois at Urbana-Champaign,
Urbana, IL 61801
e-mail: sgkapoor@illinois.edu
Department of Mechanical Science and Engineering,
University of Illinois at Urbana-Champaign,
Urbana, IL 61801
e-mail: sgkapoor@illinois.edu
1Corresponding author.
Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MICRO- AND NANO-MANUFACTURING. Manuscript received November 3, 2015; final manuscript received May 21, 2016; published online June 30, 2016. Assoc. Editor: Bin Wei.
J. Micro Nano-Manuf. Sep 2016, 4(3): 031002 (10 pages)
Published Online: June 30, 2016
Article history
Received:
November 3, 2015
Revised:
May 21, 2016
Citation
Pattabhiraman, A., Marla, D., and Kapoor, S. G. (June 30, 2016). "A Computational Model to Study Film Formation and Debris Flushing Phenomena in Spray-Electric Discharge Machining." ASME. J. Micro Nano-Manuf. September 2016; 4(3): 031002. https://doi.org/10.1115/1.4033709
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