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Amit Kulkarni
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Proceedings Papers

Intuitive 3D Computer-Aided Design (CAD) System With Multimodal Interfaces

V. G. Nanjundaswamy, Amit Kulkarni, Zhuo Chen, Prakhar Jaiswal, Sree Shankar S., Anoop Verma, Rahul Rai
Proc. ASME. IDETC-CIE2013, Volume 2A: 33rd Computers and Information in Engineering Conference, V02AT02A037, August 4–7, 2013
Publisher: American Society of Mechanical Engineers
Paper No: DETC2013-12277
https://doi.org/10.1115/DETC2013-12277
View Paper titled, Intuitive 3D Computer-Aided Design (CAD) System With Multimodal Interfaces
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Topics: Computer-aided design, Three-dimensional computer-aided design, Modeling, Brain, Computers, Electroencephalography, Signals, Switches, Three-dimensional models
Journal Articles

Properties of Higher Order Instant Center: A Case Study of Classical Motions

Amit Kulkarni, Delbert Tesar
Journal: Journal of Mechanisms and Robotics
Publisher: ASME
Article Type: Technical Briefs
J. Mechanisms Robotics. May 2013, 5(2): 024501.
Paper No: JMR-10-1148
https://doi.org/10.1115/1.4023555
Published Online: March 26, 2013
View Article titled, Properties of Higher Order Instant Center: A Case Study of Classical Motions
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Topics: Kinematics, Simulation
Journal Articles

Instant Center Based Kinematic Formulation for Planar Wheeled Platforms

Amit Kulkarni, Delbert Tesar
Journal: Journal of Mechanisms and Robotics
Publisher: ASME
Article Type: Research Papers
J. Mechanisms Robotics. August 2010, 2(3): 031015.
https://doi.org/10.1115/1.4001772
Published Online: July 27, 2010
View Article titled, Instant Center Based Kinematic Formulation for Planar Wheeled Platforms
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Topics: Algebra, Kinematics, Wheels, Manipulators, Path planning
Proceedings Papers

Effect of the Thermostatic Expansion Valve Characteristics on the Stability of a Refrigeration System: Part II

Amit Kulkarni, Dereje Agonafer, Roger Schmidt
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 613-619, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35278
https://doi.org/10.1115/IPACK2003-35278
View Paper titled, Effect of the Thermostatic Expansion Valve Characteristics on the Stability of a Refrigeration System: Part II
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Topics: Refrigeration, Stability, Valves, Stress, Temperature, Computers, Suction, Electronics, Energy dissipation, Heat flux
Proceedings Papers

Package and Board Level Study for a Thin Small Outline Package (TSOP) Using Compact Components

Amit Kulkarni, Dereje Agonafer, Steven Groothuis, Humayun Kabir, Scott Johnson
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 867-873, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35279
https://doi.org/10.1115/IPACK2003-35279
View Paper titled, Package and Board Level Study for a Thin Small Outline Package (TSOP) Using Compact Components
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Topics: Forced convection, Junctions, Manufacturing, Natural convection, Resistors, Temperature
Journal Articles

Effect of the Location and the Properties of Thermostatic Expansion Valve Sensor Bulb on the Stability of a Refrigeration System

Veerendra Mulay, Amit Kulkarni, Dereje Agonafer, ASME Fellow, Roger Schmidt, ASME Fellow
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 85–94.
https://doi.org/10.1115/1.1839584
Published Online: February 15, 2005
View Article titled, Effect of the Location and the Properties of Thermostatic Expansion Valve Sensor Bulb on the Stability of a Refrigeration System
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Topics: Refrigeration, Sensors, Temperature, Valves, Stability, Refrigerants, Flow (Dynamics), Cooling, Thermal resistance, Stress