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Ashish Sinha
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Proceedings Papers

Novel Immersion Cooling Technique for a 3D Chip Stack

Ashish Sinha, Krishna Kota, Pablo Hidalgo, Yogendra Joshi, Ari Glezer
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73039
https://doi.org/10.1115/IPACK2013-73039
View Paper titled, Novel Immersion Cooling Technique for a 3D Chip Stack
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Topics: Cooling, Fluids, Electronics, Heat, Copper, Water, Convection, Energy dissipation, Heat conduction, Heat sinks
Proceedings Papers

Performance of a Thermoelectric Adsorption Heat Pump Vis-à-Vis Thermoelectric Device and Adsorption Heat Pump for Electronics Cooling Applications

Ashish Sinha, Yogendra Joshi
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1113-1126, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-88921
https://doi.org/10.1115/IMECE2012-88921
View Paper titled, Performance of a Thermoelectric Adsorption Heat Pump Vis-à-Vis Thermoelectric Device and Adsorption Heat Pump for Electronics Cooling Applications
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Topics: Computer cooling, Heat pumps, Thermoelectric devices, Heat, Cooling, Temperature, Cycles, High temperature, Pumps
Journal Articles

Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement

Ashish Sinha, Yogendra K Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041005.
https://doi.org/10.1115/1.4005290
Published Online: December 9, 2011
View Article titled, Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement
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Topics: Copper, Heat, Heat exchangers, Temperature, Thermal management, Thermoelectric devices, Water, Manufacturing, Fluids, Cooling
Proceedings Papers

Thermoelectric Assisted Adsorption Cooling Systems for Harsh Environment Electronics: Issues With Heat Regeneration

Ashish Sinha, Yogendra Joshi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 625-633, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89021
https://doi.org/10.1115/InterPACK2009-89021
View Paper titled, Thermoelectric Assisted Adsorption Cooling Systems for Harsh Environment Electronics: Issues With Heat Regeneration
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Topics: Cooling systems, Electronics, Heat, Temperature, Desorption, Cooling, Heat pumps, Heat recovery, High temperature
Journal Articles

Application of Thermoelectric-Adsorption Cooler for Harsh Environment Electronics Under Varying Heat Load

Ashish Sinha, Yogendra Joshi
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2010, 2(2): 021004.
https://doi.org/10.1115/1.4002590
Published Online: October 21, 2010
View Article titled, Application of Thermoelectric-Adsorption Cooler for Harsh Environment Electronics Under Varying Heat Load
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Topics: Cooling, Cycles, Electronics, Heat, Stress, Temperature, Desorption, Heat pumps, Cooling systems, Vapors
Proceedings Papers

Performance of Thermoelectric Based Regenerative Adsorption Cooling System for Harsh Environment

Ashish Sinha, Yogendra Joshi
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1415-1428, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-12655
https://doi.org/10.1115/IMECE2009-12655
View Paper titled, Performance of Thermoelectric Based Regenerative Adsorption Cooling System for Harsh Environment
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Topics: Cooling systems, Heat, Cycles, Temperature, Condensers (steam plant), Desorption, Electronics, Flow (Dynamics), Computer cooling, Cooling
Proceedings Papers

Thermoelectric Cooler Based Regenerative Adsorption Refrigeration System for High Temperature Electronics

Ashish Sinha, Yogendra Joshi, Bruce H. Storm, Jr.
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 59-68, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33235
https://doi.org/10.1115/IPACK2007-33235
View Paper titled, Thermoelectric Cooler Based Regenerative Adsorption Refrigeration System for High Temperature Electronics
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Topics: Electronics, High temperature, Refrigeration, Thermoelectric coolers, Heat, Temperature, Cycles, Desorption, Cooling, Pumps