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Proceedings Papers

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

Bart Vandevelde, Chinmay Nawghane, Riet Labie, Ralph Lauwaert, Daniel Werkhoven
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73456
https://doi.org/10.1115/IPACK2021-73456
View Paper titled, Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q
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Topics: Alloys, Fatigue, Melting point, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Contamination, Failure, Failure analysis
Journal Articles

The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface

Dominiek Degryse, Bart Vandevelde, Eric Beyne, Joris Degrieck
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041003.
https://doi.org/10.1115/1.4000209
Published Online: October 21, 2009
View Article titled, The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface
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Topics: Fracture (Materials), Shear (Mechanics), Modeling, Fracture mechanics
Journal Articles

Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

Bart Vandevelde, Eric Beyne, Dirk Vandepitte, Martine Baelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 351–358.
https://doi.org/10.1115/1.1772416
Published Online: October 6, 2004
View Article titled, Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies
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Topics: Flip-chip assemblies, Stress, Thermomechanics, Flip-chip devices, Deformation, Structural mechanics, Finite element model
Journal Articles

Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

Bart Vandevelde, Eric Beyne, Kouchi (G.Q.) Zhang, Jo Caers, Dirk Vandepitte, Martine Baelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 498–505.
https://doi.org/10.1115/1.1604150
Published Online: December 15, 2003
View Article titled, Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies
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Topics: Finite element analysis, Reliability, Simulation, Solder joints, Solders, Modeling, Thermomechanics, Sensitivity analysis, Design, Dimensions