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Proceedings Papers

On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA)

Sukrut Prashant Phansalkar, Bongtae Han, Ehsan Akbari, Paulius Vaitiekunas

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 25–27, 2022

Paper No: IPACK2022-97719

DOI: https://doi.org/10.1115/IPACK2022-97719

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Topics: Filled polymers, Viscoelasticity

Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han

J. Electron. Packag. March 2020, 142(1): 011001.

Paper No: EP-19-1028

DOI: https://doi.org/10.1115/1.4043704

Published Online: August 1, 2019

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Topics: Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing

Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han

J. Electron. Packag. March 2020, 142(1): 011002.

Paper No: EP-19-1029

DOI: https://doi.org/10.1115/1.4044218

Published Online: August 1, 2019

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Topics: Corners (Structural elements), Density, Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing, Solder joints

Proceedings Papers

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Dirk Mayer, Tobias Melz

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 29–September 1, 2017

Paper No: IPACK2017-74058

DOI: https://doi.org/10.1115/IPACK2017-74058

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Topics: Electronic systems, Sensors, Silicon, Stress, Algorithms, Delamination, Failure, Vehicles, Accelerated life testing, Acoustics

Journal Articles

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

Bongtae Han, Dae-Suk Kim

J. Electron. Packag. March 2017, 139(1): 010802.

Paper No: EP-16-1107

DOI: https://doi.org/10.1115/1.4035598

Published Online: January 16, 2017

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Topics: Diffusion (Physics), Polymers, Temperature, Cavities, Semiconductors (Materials), Packaging, Water, Vapor pressure

Journal Articles

Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions

Kenny Mahan, David Rosen, Bongtae Han

J. Electron. Packag. December 2016, 138(4): 041003.

Paper No: EP-16-1046

DOI: https://doi.org/10.1115/1.4034454

Published Online: September 2, 2016

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Topics: Adhesion, Deflection, Pressure, Testing, Polymer films, Copper, Delamination

Journal Articles

Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth

Kenny Mahan, Yong Sun, Bongtae Han, Sungwon Han, Mike Osterman

J. Electron. Packag. September 2014, 136(3): 031004.

Paper No: EP-13-1084

DOI: https://doi.org/10.1115/1.4026922

Published Online: May 5, 2014

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Topics: Adhesion, Coating processes, Coatings, Testing, Urethane elastomers, Pressure

Journal Articles

Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

Changsoo Jang, Bongtae Han

J. Electron. Packag. March 2014, 136(1): 011013.

Paper No: EP-13-1091

DOI: https://doi.org/10.1115/1.4026626

Published Online: February 18, 2014

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Topics: Boiling, Polymers, Temperature, Water, Weight (Mass), Glass transition, Absorption

Proceedings Papers

Comprehensive Quantification of Sorption Characteristics in Polymer Material of Thin Film Form

Heejin Park, Ji-Hyuk Lim, Suk-Jin Ham, Bongtae Han

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 949-955, November 11–17, 2011

Paper No: IMECE2011-63339

DOI: https://doi.org/10.1115/IMECE2011-63339

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Topics: Permeability, Polymers, Sorption, Thin films

Proceedings Papers

Nano-Pattern Recognition and Correlation Technique for Nano-Scale Deformation Measurement

Hongbo Bi, Chris Hartsough, Bongtae Han

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 831-838, July 8–12, 2007

Paper No: IPACK2007-33717

DOI: https://doi.org/10.1115/IPACK2007-33717

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Topics: Deformation, Nanoscale phenomena

Proceedings Papers

Thermofluid Characteristics of Two-Phase Microgap Coolers

Dae W. Kim, Emil Rahim, Avram Bar-Cohen, Bongtae Han

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 389-398, July 8–12, 2007

Paper No: IPACK2007-33927

DOI: https://doi.org/10.1115/IPACK2007-33927

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Topics: Coolers, Thermofluids, Boiling, Flow (Dynamics), Water, Heat transfer, Computer simulation, Pressure drop

Proceedings Papers

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Changsoo Jang, Bongtae Han, Seungbae Park, Samson Yoon

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 749-755, July 8–12, 2007

Paper No: IPACK2007-33142

DOI: https://doi.org/10.1115/IPACK2007-33142

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Topics: Diffusion (Physics), Microelectronic devices, Temperature

Proceedings Papers

A Hybrid Approach to Investigate Effect of Flip-Chip Packaging on RF MEMS Devices Performance

Li Sun, Shawn Cunningham, Art Morris, Changsoo Jang, Bongtae Han

Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 205-211, October 31–November 6, 2008

Paper No: IMECE2008-67452

DOI: https://doi.org/10.1115/IMECE2008-67452

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Topics: Flip-chip, Microelectromechanical systems, Packaging, Finite element analysis, Warping, Capacitance, Computer simulation, Design, Displacement, Interferometry

Proceedings Papers

An Advanced Real-Time Moire´ Interferometry System With Conductive Heating/Cooling and Its Application on a Creep Behavior of Solder

Seungmin Cho, Changsoo Jang, Bongtae Han

Proc. ASME. IMECE2007, Volume 10: Mechanics of Solids and Structures, Parts A and B, 479-487, November 11–15, 2007

Paper No: IMECE2007-43698

DOI: https://doi.org/10.1115/IMECE2007-43698

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Topics: Cooling, Creep, Heating, Interferometry, Solders, Solder joints, Constitutive equations, Convection, Cycles, Deformation

Proceedings Papers

Measurement of Hygroscopic Swelling in Mold Compounds and Its Effect on PEM Reliability

Eric Stellrecht, Bongtae Han, Michael Pecht

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 497-503, July 6–11, 2003

Paper No: IPACK2003-35252

DOI: https://doi.org/10.1115/IPACK2003-35252

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Topics: Proton exchange membranes, Reliability

Proceedings Papers

Advanced Micro Shear Testing for Solder Alloy Using Direct Local Measurement

Soonwook Kwon, Yuri Lee, Bongtae Han

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 537-542, July 6–11, 2003

Paper No: IPACK2003-35325

DOI: https://doi.org/10.1115/IPACK2003-35325

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Topics: Alloys, Shear (Mechanics), Solders, Testing, Continuum mechanics, Deformation, Finite element methods, Finite element model, Geometry, Machinery

Journal Articles

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Samson Yoon, Changsoo Jang, Bongtae Han

J. Electron. Packag. June 2008, 130(2): 024502.

DOI: https://doi.org/10.1115/1.2912181

Published Online: May 14, 2008

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Topics: Diffusion (Physics), Finite element analysis, Heat transfer, Modeling, Semiconductors (Materials), Stress, Stress analysis (Engineering), Temperature, Deformation, Thermal expansion

Journal Articles

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Changsoo Jang, Seungbae Park, Bongtae Han, Samson Yoon

J. Electron. Packag. March 2008, 130(1): 011004.

DOI: https://doi.org/10.1115/1.2837521

Published Online: January 31, 2008

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Topics: Diffusion (Physics), Temperature, Transients (Dynamics), Finite difference methods

Journal Articles

On Moisture Diffusion Modeling Using Thermal-Moisture Analogy

Samson Yoon, Bongtae Han, Zhaoyang Wang

J. Electron. Packag. December 2007, 129(4): 421–426.

DOI: https://doi.org/10.1115/1.2804090

Published Online: April 24, 2007

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Topics: Diffusion (Physics)

Journal Articles

Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

Seungmin Cho, Bongtae Han, Mem. ASME, Jinwon Joo

J. Electron. Packag. March 2004, 126(1): 41–47.

DOI: https://doi.org/10.1115/1.1646426

Published Online: April 30, 2004

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Topics: Ceramics, Deformation, Manufacturing, Solders, Temperature, Interferometry, Ball-Grid-Array packages, Stress, Displacement

Journal citation

NARROW

On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA)

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions

Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth

Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

Comprehensive Quantification of Sorption Characteristics in Polymer Material of Thin Film Form

Nano-Pattern Recognition and Correlation Technique for Nano-Scale Deformation Measurement

Thermofluid Characteristics of Two-Phase Microgap Coolers

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

A Hybrid Approach to Investigate Effect of Flip-Chip Packaging on RF MEMS Devices Performance

An Advanced Real-Time Moire´ Interferometry System With Conductive Heating/Cooling and Its Application on a Creep Behavior of Solder

Measurement of Hygroscopic Swelling in Mold Compounds and Its Effect on PEM Reliability

Advanced Micro Shear Testing for Solder Alloy Using Direct Local Measurement

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

On Moisture Diffusion Modeling Using Thermal-Moisture Analogy

Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

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